JEDEC JESD 22-B109
Flip Chip Tensile Pull
inactive
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| Organization: | JEDEC |
| Publication Date: | 1 June 2002 |
| Status: | inactive |
| Page Count: | 11 |
Document History
March 1, 2021
Flip Chip Tensile Pull
This test method is applicable to flip chip die after the die and substrate solder joint is formed, but prior to application of underfill or other materials that increase the apparent bond strength....
July 1, 2014
Flip Chip Tensile Pull
This test method is applicable to flip chip die after the die and substrate solder joint is formed, but prior to application of underfill or other materials that increase the apparent bond strength....
January 1, 2009
Flip Chip Tensile Pull
The Flip Chip Tensile Pull Test Method is performed to determine the fracture mode and strength of the solder bump interconnection between the flip chip die and the substrate. It should be used to...
JEDEC JESD 22-B109
June 1, 2002
Flip Chip Tensile Pull
A description is not available for this item.