JEDEC JESD 22-B109
Flip Chip Tensile Pull
inactive
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| Organization: | JEDEC |
| Publication Date: | 1 January 2009 |
| Status: | inactive |
| Page Count: | 16 |
scope:
The Flip Chip Tensile Pull Test Method is performed to determine the fracture mode and strength of the solder bump interconnection between the flip chip die and the substrate. It should be used to assess the consistency of the chip join process. This test method is a destructive test.
Document History
March 1, 2021
Flip Chip Tensile Pull
This test method is applicable to flip chip die after the die and substrate solder joint is formed, but prior to application of underfill or other materials that increase the apparent bond strength....
July 1, 2014
Flip Chip Tensile Pull
This test method is applicable to flip chip die after the die and substrate solder joint is formed, but prior to application of underfill or other materials that increase the apparent bond strength....
JEDEC JESD 22-B109
January 1, 2009
Flip Chip Tensile Pull
The Flip Chip Tensile Pull Test Method is performed to determine the fracture mode and strength of the solder bump interconnection between the flip chip die and the substrate. It should be used to...
June 1, 2002
Flip Chip Tensile Pull
A description is not available for this item.
References
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