DLA - SMD-5962-87002 REV C
MICROCIRCUIT, MEMORY, DIGITAL, CMOS, 2K X 8 DUAL PORT STATIC RANDOM ACCESS MEMORY (SRAM), MONOLITHIC SILICON
| Organization: | DLA |
| Publication Date: | 27 August 1990 |
| Status: | inactive |
| Page Count: | 30 |
scope:
This drawing describes device requirements for class B microcircuits in accordance with 1.2.1 of MIL-STD-883, "Provisions for the use of MIL-STD-883 in conjunction with compliant non-JAN devices".
The complete part number shall be as shown in the following example:
The device types shall identify the circuit function as follows:
Device type Generic number Circuit function Access time 01 7132SA 2K × 8 dual port static RAM, MASTER 45 ns 02 7132SA 2K × 8 dual port static RAM, MASTER 90 ns 03 7132SA 2K × 8 dual port static RAM, MASTER 70 ns 04 7132SA 2K × 8 dual port static RAM, MASTER 55 ns 05 7132LA 2K × 8 dual port static RAM, MASTER 45 ns 06 7132LA 2K × 8 dual port static RAM, MASTER 90 ns 07 7132LA 2K × 8 dual port static RAM, MASTER 70 ns 08 7132LA 2K × 8 dual port static RAM, MASTER 55 ns 09 7142SA 2K × 8 dual port static RAM, SLAVE 45 ns 10 7142SA 2K × 8 dual port static RAM, SLAVE 90 ns 11 7142SA 2K × 8 dual port static RAM, SLAVE 70 ns 12 7142SA 2K × 8 dual port static RAM, SLAVE 55 ns 13 7142LA 2K × 8 dual port static RAM, SLAVE 45 ns 14 7142LA 2K × 8 dual port static RAM, SLAVE 90 ns 15 7142LA 2K × 8 dual port static RAM, SLAVE 70 ns 16 7142LA 2K × 8 dual port static RAM, SLAVE 55 ns
The case outlines shall be as designated in appendix C of MIL-M-38510, and as follows:
Outline letter Case outline X C-6 (52-terminal, .761" × .120", maximum), square leadless chip carrier Y Figure 1 (48-pin, 0.400" × 1.7"), small outline dual-in-line package Z D-14 (48-lead, 2.435" × .620" × .225"), dual-in-line package U Figure 1 (48-terminal, 0.550" × 0.550"), leadless chip carrier
Voltage on any pin with respect to ground 1/ - - - - −0.5 V to +7.0 V Storage temperature range - - - - - - - - - - - - - - −65°C to +150°C Power dissipation (PD)- - - - - - - - - - - - - - - - 1 W Lead temperature (soldering, 5 seconds) - - - - - - - +270°C Maximum junction temperature (TJ) 2/- - - - - - - - - +150°C
Thermal resistance, junction-to-case (θJC): Cases X and Z - - - - - - - - - - - - - - - - - - - - - - - - See MIL-M-38510, appendix C Case Y - - - - - - - - - - - - - - - - - - - - - - - - - - - 23°C/W 3/ Case U - - - - - - - - - - - - - - - - - - - - - - - - - - - 24°C/W 3/ Maximum dc output current- - - - - - - - - - - - - - - - - - - 50 mA
Case operating temperature range (TC) - - - - - - - - - - - - - −55°C to +125°C Input low voltage (VIL) - - - - - - - - - - - - - - - - - - - - −0.5 to +0.8 V dc 4/ Input high voltage (VIH) - - - - - - - - - - - - - - - - - - - +2.2 V to VCC to +0.5 V dc 4/ Supply voltage (VCC)- - - - - - - - - - - - - - - - - - - - - - +4.5 V to +5.5 V dc 4/
intended Use:
Microcircuits conforming to this drawing are intended for use when military specifications do not exist and qualified military devices that will perform the required function are not available for... View More
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