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BSI - BS EN 60191-3

Mechanical Standardization of Semiconductor Devices - Part 3: General Rules for the Preparation of Outline Drawings of Integrated Circuits

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Organization: BSI
Publication Date: 15 June 2000
Status: active
Page Count: 60
ICS Code (Electrical and electronics engineering drawings): 01.100.25
ICS Code (Semiconductor devices in general): 31.080.01

Document History

BS EN 60191-3
June 15, 2000
Mechanical Standardization of Semiconductor Devices - Part 3: General Rules for the Preparation of Outline Drawings of Integrated Circuits
A description is not available for this item.

References

This document references:
BS EN IEC 60191-1 - Mechanical standardization of semiconductor devices Part 1: General rules for the preparation of outline drawings of discrete devices
Published by BSI on April 30, 2018
A description is not available for this item.
This document references:
BS EN 60191-4 - Mechanical standardization of semiconductor devices Part 4: Coding system and classification into forms of package outlines for semiconductor device packages
Published by BSI on March 31, 2014
A description is not available for this item.
This document references:
IEC 60191-4 - Mechanical Standardization of Semiconductor Devices - Part 4: Coding System and Classification into Forms of Package Outlines for Semiconductor Device Packages
Published by IEC on March 1, 2018
This part of IEC 60191 specifies a method for the designation of package outlines and for the classification of forms of package outlines for semiconductor devices and a systematic method for...
This document references:
IEC 60191-2 - Amendment 16 Mechanical Standardization of Semiconductor Devices - Part 2: Dimensions
Published by IEC on July 1, 2007
A description is not available for this item.
This document references:
IEC 60191-1 - Mechanical standardization of semiconductor devices - Part 1: General rules for the preparation of outline drawings of discrete devices
Published by IEC on January 1, 2018
This part of IEC 60191 gives guidelines on the preparation of outline drawings of discrete devices, including discrete surface-mounted semiconductor devices with lead count less than 8. For the...
This document is referenced by:
BS EN 61666 + A1 - Industrial systems, installations and equipment and industrial products - Identification of terminals within a system
Published by BSI on November 30, 2010
A description is not available for this item.
This document is referenced by:
BS EN 60191-6 - Mechanical standardization of semiconductor devices Part 6: General rules for the preparation of outline drawings of surface mounted semiconductor device packages
Published by BSI on April 30, 2010
A description is not available for this item.
This document is referenced by:
BS EN 60191-6-16 - Mechanical standardization of semiconductor devices - Part 6-16: Glossary of semiconductor tests and burn-in sockets for BGA, LGA, FBGA and FLGA
Published by BSI on July 31, 2007
A description is not available for this item.
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