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DLA - DSCC-VID-V62/14623

MICROCIRCUIT, DIGITAL, POWER QUICC III INTEGRATED PROCESSOR, MONOLITHIC SILICON

inactive
Organization: DLA
Publication Date: 28 July 2014
Status: inactive
Page Count: 62
scope:

This drawing documents the general requirements of a high performance power QUICC III integrated processor microcircuit, with an operating temperature range of -55°C to +125°C.

Document History

DSCC-VID-V62/14623 REV A
August 16, 2017
MICROCIRCUIT, DIGITAL, POWER QUICC III INTEGRATED PROCESSOR, MONOLITHIC SILICON
This drawing documents the general requirements of a high performance power QUICC III integrated processor microcircuit, with an operating temperature range of -55°C to +125°C.
DSCC-VID-V62/14623
July 28, 2014
MICROCIRCUIT, DIGITAL, POWER QUICC III INTEGRATED PROCESSOR, MONOLITHIC SILICON
This drawing documents the general requirements of a high performance power QUICC III integrated processor microcircuit, with an operating temperature range of -55°C to +125°C.

References

This document references:
JEDEC JESD 51-6 - Integrated Circuit Thermal Test Method Environmental Conditions - Forced Convection (Moving Air)
Published by JEDEC on March 1, 1999
This standard specifies the environmental conditions for determining thermal performance of an integrated circuit device in a forced convection environment when mounted on a standard thermal test...
This document references:
JEDEC JESD 51-7 - High Effective Thermal Conductivity Test Board for Leaded Surface Mount Packages
Published by JEDEC on February 1, 1999
This fixturing further defines the environment for thermal test of packaged microelectronic devices. Its function is to provide an alternate mounting surface for the analysis of heat flow in...
This document references:
JEDEC JESD 51-8 - Integrated Circuit Thermal Test Method Environmental Conditions - Junction-to-Board
Published by JEDEC on October 1, 1999
This specification should be used in conjunction with the overview document JESD51, Methodology for the Thermal Measurement of Component Packages (Single Semiconductor Device) [1] and the electrical...
This document references:
MIL-STD-883 - TEST METHOD STANDARD MICROCIRCUITS
Published by NPFC on September 16, 2019
Purpose. This standard establishes uniform methods, controls, and procedures for testing microelectronic devices suitable for use within Military and Aerospace electronic systems including basic...
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