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ISO 9453

Soft solder alloys - Chemical compositions and forms

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Organization: ISO
Publication Date: 1 August 2014
Status: inactive
Page Count: 24
ICS Code (Brazing and soldering): 25.160.50
scope:

WARNING - National or regional regulations may limit the employment of certain alloys.

This International Standard specifies the requirements for chemical composition for soft solder alloys containing two or more of tin, lead, antimony, copper, silver, bismuth, zinc, indium and/or cadmium.

An indication of the forms generally available is also included.

Document History

September 1, 2020
Soft solder alloys — Chemical compositions and forms
This document specifies the requirements for chemical composition for soft solder alloys containing two or more of: tin, lead, antimony, copper, silver, bismuth, zinc, indium and/or cadmium. An...
ISO 9453
August 1, 2014
Soft solder alloys - Chemical compositions and forms
WARNING — National or regional regulations may limit the employment of certain alloys. This International Standard specifies the requirements for chemical composition for soft solder alloys...
October 1, 2006
Soft Solder Alloys - Chemical Compositions and Forms
A description is not available for this item.
January 1, 1990
Soft Solder Alloys - Chemical Compositions and Forms First Edition (CEN EN 29453: 1993)
A description is not available for this item.

References

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