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ISO 9453

Soft Solder Alloys - Chemical Compositions and Forms

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Organization: ISO
Publication Date: 1 October 2006
Status: inactive
Page Count: 22
ICS Code (Brazing and soldering): 25.160.50

Document History

ISO 9453
September 1, 2020
Soft solder alloys — Chemical compositions and forms
This document specifies the requirements for chemical composition for soft solder alloys containing two or more of: tin, lead, antimony, copper, silver, bismuth, zinc, indium and/or cadmium. An...
ISO 9453
August 1, 2014
Soft solder alloys - Chemical compositions and forms
WARNING — National or regional regulations may limit the employment of certain alloys. This International Standard specifies the requirements for chemical composition for soft solder alloys...
ISO 9453
October 1, 2006
Soft Solder Alloys - Chemical Compositions and Forms
A description is not available for this item.
ISO 9453
January 1, 1990
Soft Solder Alloys - Chemical Compositions and Forms First Edition (CEN EN 29453: 1993)
A description is not available for this item.

References

This document is referenced by:
BS EN ISO 9455-10 - Soft soldering fluxes - Test methods - Part 10: Flux efficacy test, solder spread method
Published by BSI on November 30, 2012
A description is not available for this item.
This document is referenced by:
BS EN 60068-2-69 - Environmental testing Part 2-69 - Tests – Test Te/Tc: Solderability testing of electronic components and printed boards by the wetting balance (force measurement) method
Published by BSI on July 31, 2017
A description is not available for this item.
This document is referenced by:
BS EN 61190-1-2 - Attachment materials for electronic assembly - Part 1-2: Requirements for soldering pastes for high-quality interconnects in electronics assembly
Published by BSI on June 30, 2014
A description is not available for this item.
This document is referenced by:
IEC 60068-2-69 - Environmental testing – Part 2-69: Tests – Test Te/Tc: Solderability testing of electronic components and printed boards by the wetting balance (force measurement) method
Published by IEC on June 1, 2019
This part of IEC 60068 outlines test Te/Tc, the solder bath wetting balance method and the solder globule wetting balance method to determine, quantitatively, the solderability of the terminations....
This document is referenced by:
IEC 61191-1 - Printed board assemblies – Part 1: Generic specification – Requirements for soldered electrical and electronic assemblies using surface mount and related assembly technologies
Published by IEC on September 1, 2018
This part of IEC 61191 prescribes requirements for materials, methods and verification criteria for producing quality soldered interconnections and assemblies using surface mount and related assembly...
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