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IEC - TS 61967-3

Integrated circuits – Measurement of electromagnetic emissions – Part 3: Measurement of radiated emissions – Surface scan method

active, Most Current
Organization: IEC
Publication Date: 1 August 2014
Status: active
Page Count: 78
ICS Code (Integrated circuits. Microelectronics): 31.200
scope:

This part of IEC 61967 provides a test procedure which defines an evaluation method for the near electric, magnetic or electromagnetic field components at or near the surface of an integrated circuit (IC). This diagnostic procedure is intended for IC architectural analysis such as floor planning and power distribution optimization. This test procedure is applicable to measurements on an IC mounted on any circuit board that is accessible to the scanning probe. In some cases it is useful to scan not only the IC but also its environment. For comparison of surface scan emissions between different ICs, the standardized test board defined in IEC 61967-1 should be used.

This measurement method provides a mapping of the electric or magnetic near-field emissions over the IC. The resolution of the measurement is determined by the capability of the measurement probe and the precision of the probe-positioning system. This method is intended for use up to 6 GHz. Extending the upper limit of frequency is possible with existing probe technology but is beyond the scope of this specification. Measurements may be carried out in the frequency domain or in the time domain.

Document History

TS 61967-3
August 1, 2014
Integrated circuits – Measurement of electromagnetic emissions – Part 3: Measurement of radiated emissions – Surface scan method
This part of IEC 61967 provides a test procedure which defines an evaluation method for the near electric, magnetic or electromagnetic field components at or near the surface of an integrated circuit...
June 1, 2005
Integrated circuits Measurement of electromagnetic emissions, 150 kHz to 1 GHz Part 3: Measurement of radiated emissions Surface scan method
This part of IEC 61967 provides a test procedure which defines a method for evaluating the near electric, magnetic or electromagnetic field components at or near the surface of an integrated circuit...

References

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