IEC 60749-6
SEMICONDUCTOR DEVICES – MECHANICAL AND CLIMATIC TEST METHODS – Part 6: Storage at high temperature CORRIGENDUM 1
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| Organization: | IEC |
| Publication Date: | 1 August 2003 |
| Status: | inactive |
| Page Count: | 14 |
| ICS Code (Semiconductor devices in general): | 31.080.01 |
Document History
March 1, 2017
Semiconductor devices - Mechanical and climatic test methods - Part 6: Storage at high temperature
The purpose of this part of IEC 60749 is to test and determine the effect on all solid state electronic devices of storage at elevated temperature without electrical stress applied. This test is...
IEC 60749-6
August 1, 2003
SEMICONDUCTOR DEVICES – MECHANICAL AND CLIMATIC TEST METHODS – Part 6: Storage at high temperature CORRIGENDUM 1
A description is not available for this item.
April 1, 2002
Semiconductor Devices - Mechanical and Climatic Test Methods - Part 6: Storage at High Temperature
A description is not available for this item.