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BSI - BS IEC 61189-5-4

Test methods for electrical materials, printed boards and other interconnection structures and assemblies Part 5-4: General test methods for materials and assemblies — Solder alloys and fluxed and non-fluxed solid wire for printed board assemblies

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Organization: BSI
Publication Date: 31 January 2015
Status: inactive
Page Count: 26
ICS Code (Printed circuits and boards): 31.180

Document History

BS IEC 61189-5-4
January 31, 2015
Test methods for electrical materials, printed boards and other interconnection structures and assemblies Part 5-4: General test methods for materials and assemblies — Solder alloys and fluxed and non-fluxed solid wire for printed board assemblies
A description is not available for this item.
BS EN 61189-5-4
January 31, 2015
Test methods for electrical materials, printed boards and other interconnection structures and assemblies Part 5-4: General test methods for materials and assemblies — Solder alloys and fluxed and non-fluxed solid wire for printed board assemblies
A description is not available for this item.

References

This document references:
ISO 9455-2 - Soft Soldering Fluxes - Test Methods - Part 2: Determination of Non-Volatile Matter, Ebulliometric Method
Published by ISO on January 1, 1993
A description is not available for this item.
This document references:
ISO 9455-1 - Soft Soldering Fluxes - Test Methods - Part 1: Determination of Non- Volatile Matter, Gravimetric Method (CEN EN 29455-1: 1993)
Published by ISO on January 1, 1990
A description is not available for this item.
This document references:
IEC 61249-2-7 - Materials for Printed Boards and Other Interconnecting Structures - Part 2-7: Reinforced Base Materials Clad and Unclad - Epoxide Woven E-Glass Laminated Sheet of Defined Flammability (Vertical Burning Test), Copper-Clad
Published by IEC on March 1, 2002
A description is not available for this item.
This document references:
IEC 61190-1-3 - Attachment materials for electronic assembly – Part 1-3: Requirements for electronic grade solder alloys and fluxed and nonfluxed solid solder for electronic soldering applications
Published by IEC on December 1, 2017
This part of IEC 61190 prescribes the requirements and test methods for electronic grade solder alloys, for fluxed and non-fluxed bar, ribbon, powder solders and solder paste, for electronic...
This document references:
IEC 61190-1-2 - Attachment materials for electronic assembly – Part 1-2: Requirements for soldering pastes for high-quality interconnects in electronics assembly
Published by IEC on February 1, 2014
A description is not available for this item.
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