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IEC TS 62878-2-1

Device embedded substrate – Part 2-1: Guidelines – General description of technology

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Organization: IEC
Publication Date: 1 March 2015
Status: active
Page Count: 64
ICS Code (Electronic component assemblies): 31.190
ICS Code (Printed circuits and boards): 31.180
scope:

This part of IEC 62878 describes the basics of device embedding substrate.

This part of IEC 62878 is applicable to device embedded substrates fabricated by use of organic base material, which include for example active or passive devices, discrete components formed in the fabrication process of electronic wiring board, and sheet formed components.

The IEC 62878 series neither applies to the re-distribution layer (RDL) nor to the electronic modules defined as an M-type business model in IEC 62421.

Document History

IEC TS 62878-2-1
March 1, 2015
Device embedded substrate – Part 2-1: Guidelines – General description of technology
This part of IEC 62878 describes the basics of device embedding substrate. This part of IEC 62878 is applicable to device embedded substrates fabricated by use of organic base material, which...

References

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