IEC TS 62878-2-3
Device embedded substrate – Part 2-3: Guidelines – Design guide
|Publication Date:||1 March 2015|
|ICS Code (Electronic component assemblies):||31.190|
|ICS Code (Printed circuits and boards):||31.180|
This part of IEC 62878 describes the design guide of device embedded substrates.
The design guide of device embedded substrate is essentially the same as that of various electronic circuit boards. This part of IEC 62878 enables a thorough understanding of circuit design, structure design, board design, board manufacturing, jisso (assembly processes) and tests of products.
This part of IEC 62878 is applicable to device embedded substrates fabricated by use of organic base material, which include for example active or passive devices, discrete components formed in the fabrication process of electronic wiring board, and sheet formed components.
The IEC 62878 series neither applies to the re-distribution layer (RDL) nor to the electronic modules defined as an M-type business model in IEC 62421.