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BSI - BS EN 61760-4

Surface mounting technology Part 4: Classification, packaging, labelling and handling of moisture sensitive devices

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Organization: BSI
Publication Date: 31 July 2015
Status: inactive
Page Count: 38
ICS Code (Electronic component assemblies): 31.190

Document History

BS EN 61760-4
July 31, 2015
Surface mounting technology Part 4: Classification, packaging, labelling and handling of moisture sensitive devices
A description is not available for this item.
BS EN 61760-4
July 31, 2015
Surface mounting technology Part 4: Classification, packaging, labelling and handling of moisture sensitive devices
A description is not available for this item.
BS EN 61760-4
July 31, 2015
Surface mounting technology Part 4: Classification, packaging, labelling and handling of moisture sensitive devices
A description is not available for this item.

References

This document references:
61760-2 - Surface mounting technology – Part 2: Transportation and storage conditions of surface mounting devices (SMD) – Application guide
Published by IEC on July 1, 2021
This International Standard specifies the transportation and storage conditions for surface mounting devices (SMDs) that are fulfilled in order to enable trouble-free processing of surface mounting...
This document references:
IEC 60749-20-1 - Semiconductor devices – Mechanical and climatic test methods – Part 20-1: Handling, packing, labelling and shipping of surface-mount devices sensitive to the combined effect of moisture and soldering heat
Published by IEC on June 1, 2019
This part of IEC 60749 applies to all devices subjected to bulk solder reflow processes during PCB assembly, including plastic encapsulated packages, process sensitive devices, and other...
This document references:
EN IEC 61760-2 - Surface mounting technology - Part 2: Transportation and storage conditions of surface mounting devices (SMD) - Application guide
Published by CENELEC on September 1, 2021
This International Standard specifies the transportation and storage conditions for surface mounting devices (SMDs) that are fulfilled in order to enable trouble-free processing of surface mounting...
This document references:
EN 61340-5-1 - Electrostatics - Part 5-1: Protection of electronic devices from electrostatic phenomena - General requirements
Published by CENELEC on November 1, 2016
This part of IEC 61340 applies to activities that: manufacture, process, assemble, install, package, label, service, test, inspect, transport or otherwise handle electrical or electronic parts,...
This document references:
EN 60749-20-1 - Semiconductor devices - Mechanical and climatic test methods - Part 20-1: Handling, packing, labelling and shipping of surface-mount devices sensitive to the combined effect of moisture and soldering heat
Published by CENELEC on June 1, 2009
A description is not available for this item.
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