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CENELEC - EN IEC 61760-2

Surface mounting technology - Part 2: Transportation and storage conditions of surface mounting devices (SMD) - Application guide

active, Most Current
Organization: CENELEC
Publication Date: 1 September 2021
Status: active
Page Count: 22
ICS Code (Mechanical structures for electronic equipment): 31.240
scope:

This International Standard specifies the transportation and storage conditions for surface mounting devices (SMDs) that are fulfilled in order to enable trouble-free processing of surface mounting devices, both active and passive. (Conditions for printed boards are not taken into consideration.)

The object of this document is to ensure that users of SMDs receive and store products that can be further processed (e.g. positioned, soldered) without prejudice to quality and reliability. Improper transportation and storage of SMDs can cause deterioration and result in assembly problems such as poor solderability, delamination and "popcorning".

Document History

EN IEC 61760-2
September 1, 2021
Surface mounting technology - Part 2: Transportation and storage conditions of surface mounting devices (SMD) - Application guide
This International Standard specifies the transportation and storage conditions for surface mounting devices (SMDs) that are fulfilled in order to enable trouble-free processing of surface mounting...
EN 61760-2
June 1, 2007
Surface mounting technology - Part 2: Transportation and storage conditions of surface mounting devices (SMD) - Application guide
A description is not available for this item.
EN 61760-2
April 1, 1998
Surface Mounting Technology Part 2: Transportation and Storage Conditions of Surface Mounting Devices (SMD) - Application Guide
A description is not available for this item.

References

This document references:
IEC 60286-3 - Packaging of components for automatic handling - Part 3: Packaging of surface mount components on continuous tapes
Published by IEC on January 1, 2019
This part of IEC 60286 is applicable to the tape packaging of electronic components without leads or with lead stumps, intended to be connected to electronic circuits. It includes only those...
This document references:
IEC 60286-4 - Packaging of components for automatic handling – Part 4: Stick magazines for electronic components encapsulated in packages of different forms
Published by IEC on July 1, 2013
This part of IEC 60286 is applicable to stick magazines (including end stoppers) intended to be used for storage of electronic components, for transport from the manufacturer to the customer and for...
This document references:
IEC 60286-5 - Packaging of components for automatic handling – Part 5: Matrix trays
Published by IEC on April 1, 2018
This part of IEC 60286 describes the common dimensions, tolerances and characteristics of the tray. It includes only those dimensions that are essential for the handling of the trays for the stated...
This document references:
IEC 60286-6 - Packaging of components for automatic handling Part 6: Bulk case packaging for surface mounting components
Published by IEC on February 1, 2004
A description is not available for this item.
This document references:
IEC 60721-3-1 - Classification of environmental conditions – Part 3-1: Classification of groups of environmental parameters and their severities – Storage
Published by IEC on February 1, 2018
This part of IEC 60721 classifies the groups of environmental parameters and their severities to which products together with their packaging, if any, are subjected when stored. The environmental...
This document is referenced by:
BS EN IEC 61760-3 - Surface mounting technology Part 3: Standard method for the specification of components for Through Hole Reflow (THR) soldering
Published by BSI on March 31, 2021
A description is not available for this item.
This document is referenced by:
BS EN IEC 61191-1 - Printed Board Assemblies Part 1: Generic Specification - Requirements for Soldered Electrical and Electronic Assemblies Using Surface Mount and Related Assembly Technologies
Published by BSI on November 30, 2018
A description is not available for this item.
This document is referenced by:
BS EN IEC 61760-1 - Surface Mounting Technology Part 1: Standard method for the specification of surface mounting components (SMDs)
Published by BSI on September 30, 2020
A description is not available for this item.
This document is referenced by:
BS EN IEC 61191-1 - TC - Tracked Changes (Redline) - Printed board assemblies Part 1: Generic specification – Requirements for soldered electrical and electronic assemblies using surface mount and related assembly technologies
Published by BSI on February 27, 2020
A description is not available for this item.
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