BSI - BS EN 62047-16
Semiconductor devices — Micro-electromechanical devices Part 16: Test methods for determining residual stresses of MEMS films — Wafer curvature and cantilever beam deflection methods
active, Most Current
Buy Now
| Organization: | BSI |
| Publication Date: | 31 July 2015 |
| Status: | active |
| Page Count: | 18 |
| ICS Code (Other semiconductor devices): | 31.080.99 |
Document History
BS EN 62047-16
July 31, 2015
Semiconductor devices — Micro-electromechanical devices Part 16: Test methods for determining residual stresses of MEMS films — Wafer curvature and cantilever beam deflection methods
A description is not available for this item.