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BSI - BS EN 62090

Product package labels for electronic components using bar code and two-dimensional symbologies

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Organization: BSI
Publication Date: 2 April 2003
Status: inactive
Page Count: 50
ICS Code (Electronic component assemblies): 31.190
ICS Code (Integrated circuits. Microelectronics): 31.200
ICS Code (Automatic identification and data capture techniques): 35.040.50

Document History

BS EN 62090
July 31, 2017
Product package labels for electronic components using bar code and two-dimensional symbologies
A description is not available for this item.
BS EN 62090
April 2, 2003
Product package labels for electronic components using bar code and two-dimensional symbologies
A description is not available for this item.

References

This document references:
60286-2 - Packaging of components for automatic handling – Part 2: Tape packaging of components with unidirectional leads on continuous tapes
Published by IEC on November 1, 2022
This part of IEC 60286 applies to the tape packaging of components with two or more unidirectional leads for use in electronic equipment. It provides dimensions and tolerances necessary to tape...
This document references:
IEC 60286-1 - Packaging of components for automatic handling – Part 1: Tape packaging of components with axial leads on continuous tapes
Published by IEC on April 1, 2021
This part of IEC 60286 applies to the tape packaging of components with axial leads for use in electronic equipment. In general, the tape is applied to the component leads. It covers requirements for...
This document references:
IEC 60286-4 - Packaging of components for automatic handling – Part 4: Stick magazines for electronic components encapsulated in packages of different forms
Published by IEC on July 1, 2013
This part of IEC 60286 is applicable to stick magazines (including end stoppers) intended to be used for storage of electronic components, for transport from the manufacturer to the customer and for...
This document is referenced by:
BS EN 61188-5-8 - Printed boards and printed board assemblies - Design and use - Part 5-8: Attachment (land/joint) considerations - Area array components (BGA, FBGA, CGA, LGA)
Published by BSI on May 30, 2008
A description is not available for this item.
This document is referenced by:
BS EN IEC 61760-3 - Surface mounting technology Part 3: Standard method for the specification of components for Through Hole Reflow (THR) soldering
Published by BSI on March 31, 2021
A description is not available for this item.
This document is referenced by:
BS EN IEC 61760-1 - Surface Mounting Technology Part 1: Standard method for the specification of surface mounting components (SMDs)
Published by BSI on September 30, 2020
A description is not available for this item.
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