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DOD - SMD 5962-87517

MICROCIRCUIT, DIGITAL, LOW POWER SCHOTTKY TTL, BINARY COUNTER, MONOLITHIC SILICON

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Organization: DOD
Publication Date: 9 November 2015
Status: inactive
Page Count: 13
scope:

This drawing describes device requirements for MIL-STD-883 compliant, non-JAN class level B microcircuits in accordance with MIL-PRF-38535, appendix A.

intended Use:

Microcircuits conforming to this drawing are intended for use for Government microcircuit applications (original equipment), design applications, and logistics purposes.

Document History

SMD 5962-87517
September 1, 2020
MICROCIRCUIT, DIGITAL, LOW POWER SCHOTTKY TTL, BINARY COUNTER, MONOLITHIC SILICON
Scope. This drawing describes device requirements for MIL-STD-883 compliant, non-JAN class level B microcircuits in accordance with MIL-PRF-38535, appendix A.
SMD 5962-87517
November 9, 2015
MICROCIRCUIT, DIGITAL, LOW POWER SCHOTTKY TTL, BINARY COUNTER, MONOLITHIC SILICON
Microcircuits conforming to this drawing are intended for use for Government microcircuit applications (original equipment), design applications, and logistics purposes.
SMD 5962-87517
March 18, 2009
MICROCIRCUIT, DIGITAL, LOW POWER SCHOTTKY TTL, BINARY COUNTER, MONOLITHIC SILICON
Microcircuits conforming to this drawing are intended for use for Government microcircuit applications (original equipment), design applications, and logistics purposes.
SMD-5962-87517 REV B
November 29, 2001
MICROCIRCUIT, DIGITAL, LOW POWER SCHOTTKY TTL, BINARY COUNTER, MONOLITHIC SILICON
A description is not available for this item.
SMD-5962-87517 REV A
February 5, 1992
MICROCIRCUIT, DIGITAL, LOW POWER SCHOTTKY TTL, BINARY COUNTER, MONOLITHIC SILICON
This drawing describes device requirements for class B microcircuits in accordance with 1.2.1 of MIL-STD-883, "Provisions for the use of MIL-STD-883 in conjunction with compliant non-JAN devices"....
SMD-5962-87517
January 26, 1988
MICROCIRCUIT, DIGITAL, LOW POWER SCHOTTKY TTL, BINARY COUNTER, MONOLITHIC SILICON
A description is not available for this item.
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References

This document references:
MIL-PRF-38535M - INTEGRATED CIRCUITS (MICROCIRCUITS) MANUFACTURING, GENERAL SPECIFICATION FOR
Published by DLA on November 1, 2022
Scope. This specification establishes the general performance requirements for integrated circuits or microcircuits and the quality and reliability assurance requirements, which are to be met for...
This document references:
MIL-STD-1835 - Electronic Component Case Outlines
Published by NPFC on September 21, 2009
This standard establishes and maintains a compilation of electronic component case outlines and should be useful to all levels of manufacturing that culminate in the production of reliable and...
This document references:
MIL-HDBK-103 - LIST OF STANDARD MICROCIRCUIT DRAWINGS
Published by NPFC on March 8, 2021
Purpose. The Standard Microcircuit Drawing Program (SMDP) is directly under the auspices of the DoD Parts Management Program (PMP). The PMP is implemented by MIL-HDBK-512, "Parts Management." The PMP...
This document references:
MIL-HDBK-780D VALID NOTICE 1 - Standard Microcircuit Drawings
Published by DLA on December 28, 2021
A description is not available for this item.
This document references:
MIL-STD-883 - TEST METHOD STANDARD MICROCIRCUITS
Published by NPFC on September 16, 2019
Purpose. This standard establishes uniform methods, controls, and procedures for testing microelectronic devices suitable for use within Military and Aerospace electronic systems including basic...
This document is referenced by:
BS DD IEC TS 62239 - Process management for avionics Preparation of an electronic components management plan
Published by BSI on August 14, 2003
A description is not available for this item.
This document is referenced by:
BS EN IEC 62239-1 - Process management for avionics - Management plan Part 1: Preparation and maintenance of an electronic components management plan
Published by BSI on December 31, 2018
A description is not available for this item.
This document is referenced by:
IEC 62239-1 - Process management for avionics – Management plan – Part 1: Preparation and maintenance of an electronic components management plan
Published by IEC on September 1, 2018
This part of IEC 62239 defines the requirements for developing an electronic components management plan (ECMP) to guarantee to customers that all of the electronic components in the equipment of the...
This document is referenced by:
EN IEC 62239-1 - Process management for avionics - Management plan - Part 1: Preparation and maintenance of an electronic components management plan
Published by CENELEC on December 1, 2018
This part of IEC 62239 defines the requirements for developing an electronic components management plan (ECMP) to guarantee to customers that all of the electronic components in the equipment of the...
This document is referenced by:
CEI EN IEC 62239-1 - Process management for avionics - Management plan Part 1: Preparation and maintenance of an electronic components management plan
Published by CEI on February 1, 2019
This part of IEC 62239 defines the requirements for developing an electronic components management plan (ECMP) to guarantee to customers that all of the electronic components in the equipment of the...
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