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IPC-6012 GERMAN

Qualification and Performance Specification for Rigid Printed Boards

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Organization: IPC
Publication Date: 1 September 2015
Status: inactive
Page Count: 76

Document History

IPC-6012 GERMAN
March 1, 2020
Qualifikation und Leistungsspezifikation für starre Leiterplatten
A description is not available for this item.
IPC-6012 GERMAN
September 1, 2015
Qualification and Performance Specification for Rigid Printed Boards
A description is not available for this item.
IPC-6012 GERMAN
April 1, 2010
Qualification and Performance Specification for Rigid Printed Boards
Diese Spezifikation deckt die Qualifikation und Leistungs-spezifikation für starre Leiterplatten ab. Die Leiterplatte kann einseitig oder zweiseitig, mit oder ohne durchkontaktierten Löchern...
IPC-6012 GERMAN
August 1, 2004
Qualification and Performance Specification for Rigid Printed Boards
Diese Spezifikation deckt die Qualifikation und Leistungs-spezifikation für starre Leiterplatten ab. Die Leiterplatte kann einseitig oder zweiseitig, mit oder ohne durchkontaktierten Löchern...

References

This document references:
ASME B46.1 - Surface Texture (Surface Roughness, Waviness, and Lay)
Published by ASME on January 1, 2019
This Standard is concerned with the geometric irregularities of surfaces. It defines surface texture and its constituents: roughness, waviness, and lay. It also defines parameters for specifying...
This document references:
IPC-QL-653 - Certification of Facilities That Inspect/Test Printed Boards, Components and Materials
Published by IPC on November 1, 1997
This specification establishes the certification requirements for facilities that inspect/test printed boards, components and materials. This specification is intended to provide a minimum...
This document references:
J-STD-003 - Solderability Tests for Printed Boards
Published by IPC on April 1, 2014
This standard prescribes test methods, defect definitions, and illustrations for assessing the solderability of printed wiring board surface conductors, attachment lands, and plated-through holes...
This document references:
TM-650 2.4.21F - Land Bond Strength, Unsupported Component Hole
Published by IPC on January 1, 2007
This test method is to determine the land bond strength of unsupported holes, after repeated soldering and unsoldering, by mechanical pull in the perpendicular plane.
This document references:
IPC-2251 - Design Guide for the Packaging of High Speed Electronic Circuits
Published by IPC on November 1, 2003
The goal in electronic packaging is to transfer a signal from one device to one or more other devices through a conductor. Considerations include electrical noise, electromagnetic interference,...
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