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MCGRAW - CAPACITORS - CAPACITORS Organization: MCGRAW
Date: 2015-01-01
Description: Computers, mobile devices, power supplies, automobiles, and other systems are consuming unprecedented quantities of capacitors. This book discusses capacitor physics, raw materials, and the latest manufacturing processes and describes how to select appropriate products for specific applications.
CRC - DKE4276 - POWER SYSTEM CAPACITORS Organization: CRC
Date: 2005-03-30
Description: The author describes the fundamentals of capacitors focused on the power factor correction, industry standards, capacitor specifications, protection of shunt capacitors, maintenance of capacitor banks, and system impact issues.
ECIA - EIA-521 - APPLICATION GUIDE FOR MULTILAYER CERAMIC CAPACITORS - ELECTRICAL Organization: ECIA
Date: 2013-12-01
Description: Because of the great variety of electrical characteristics found in ceramic capacitors, the Electronic Component Industry Association (ECIA) has categorized ceramic capacitors into four separate classes.
ECIA - EIA-757 - VISUAL AND MECHANICAL INSPECTION FOR MOLDED SMT SOLID TANTALUM CAPACITORS Organization: ECIA
Date: 2015-03-01
Description: This document covers the general industry inspection requirements for molded surface mount tantalum capacitors with solid electrolyte.
ECIA - EIA-595 - VISUAL AND MECHANICAL INSPECTION MULTILAYER CERAMIC CHIP CAPACITORS Organization: ECIA
Date: 2009-02-01
Description: This document covers the general industry inspection requirements for multilayer ceramic chip capacitors. The devices selected for inspection may be examined under 10 to 20 power magnification to determine compliance with the requirements specified herein.
IEEE C37.116 - GUIDE FOR PROTECTIVE RELAY APPLICATION TO TRANSMISSION-LINE SERIES CAPACITOR BANKS Organization: IEEE
Date: 2007-02-07
Description: The protection and control of distribution system series capacitors and application of variable series capacitors, such as thyristor-controlled series capacitors, are not covered in this guide.
ABS - 288 - GUIDE FOR USE OF SUPERCAPACITORS IN THE MARINE AND OFFSHORE INDUSTRIES Organization: ABS
Date: 2017-01-01
Description: The supercapacitors covered by this Guide are also referred as Electric Double-Layer Capacitors (EDLC), Electrochemical Capacitors, or Ultracapacitors. For requirements applicable to conventional electrolytic capacitors used for harmonic filtering, please refer to the requirements in 4-8-2/9.23 of the Steel Vessel Rules.
PIP ELSPF01D EEDS - ELECTRONIC ENTRY DATA SHEET FOR MEDIUM-VOLTAGE METAL-ENCLOSED POWER FACTOR CORRECTION CAPACITOR SPECIFICATION FROM 2.4 KV TO 35 KV Organization: PIP
Date: 2011-09-01
Description: PURPOSE AND USE OF PROCESS INDUSTRY PRACTICES In an effort to minimize the cost of process industry facilities, this Practice has been prepared from the technical requirements in the existing standards of major industrial users, contractors, or standards organizations.
PIP ELSPF01D - DATA SHEET FOR MEDIUM-VOLTAGE METAL-ENCLOSED POWER FACTOR CORRECTION CAPACITOR SPECIFICATION FROM 2.4 KV TO 35 KV Organization: PIP
Date: 2011-09-01
Description: PURPOSE AND USE OF PROCESS INDUSTRY PRACTICES In an effort to minimize the cost of process industry facilities, this Practice has been prepared from the technical requirements in the existing standards of major industrial users, contractors, or standards organizations.
ITU-T Y.4114 - SPECIFIC REQUIREMENTS AND CAPABILITIES OF THE INTERNET OF THINGS FOR BIG DATA - STUDY GROUP 20 Organization: ITU-T
Date: 2017-07-01
Description: The topics considered are: - families of electrical energy storage such as batteries or super-capacitors; - technologies types and their main properties; - adaptation to requirements (functionalities, technology availability, electrical characteristics, environmental adaptation, maintenance type, cost, etc.)
SAE/TP - 2010-01-1799 - AIR-LAUNCHED EXPENDABLE SMALL UNMANNED AIRCRAFT SYSTEMS: INCREASING POWER AND EXTENDING ENDURANCE TO MEET OPERATIONAL NEEDS Organization: SAE/TP
Date: 2010-11-02
Description: The end goal will highlight realistic technology requirements for industry to develop an optimized system engineering design in the next two years that combines current cutting edge technology (i.e. super-capacitors, nano/micro-fuel cells, hybrid solutions and traditional batteries solutions) with industry safety standards for effective mission accomplishment.
IEEE 1651 - GUIDE FOR REDUCING BIRD-RELATED OUTAGES Organization: IEEE
Date: 2010-12-30
Description: Purpose Recommended procedures and techniques for reducing bird related contamination, streamer, electrocution and collision (contact) outages on transmission lines, in substations and on overhead distribution lines, including all apparatuses and devices, such as insulators, transformers, surge arresters, capacitor banks, poles etc. are provided. The information in this guide was drawn from electric utilities, suppliers, universities, related industries, and personal observations.
IEEE PC37.100.5 DRAFT - STANDARD FOR DEFINITIONS OF HIGH VOLTAGE CIRCUIT BREAKERS ABOVE 1000 VAC AND 3200 VDC, AND RECLOSERS AND OTHER DISTRIBUTION EQUIPMENT FROM 1000 VAC TO 38,000 VAC Organization: IEEE
Date: 2017-09-01
Description: Purpose The definitions of terms and explanatory notes relating thereto contained in this standard are intended for the sole purpose of establishing only those meanings of terms used in standards for high-voltage circuit breakers above 1000 Vac and 3200 Vdc, and distribution switching and overcurrent protective equipment including: reclosers, sectionalizers, fault interrupters, capacitor switches, pad-mounted gear, and submersible gear within the C37 series of standards.
SAE/TP - 2008-01-2225 - GOING GREEN: WHAT’S IN IT FOR GENERAL AVIATION? Organization: SAE/TP
Date: 2008-08-19
Description: The very successful introduction of gasoline-electric hybrid automobiles has spawned intense research and development of advanced batteries, ultra-capacitors, electric motors and controls. Opportunities for adapting automobile technologies to small general aviation airplanes should be exploited.
ECIA - JEDEC/ECA JS709 - DEFINING “LOW-HALOGEN” PASSIVES AND SOLID STATE DEVICES (REMOVAL OF BFR/CFR/PVC) Organization: ECIA
Date: 2011-08-01
Description: Examples of passive devices include resistors, capacitors, relays, inductors and connectors. Examples of electronic devices that are not covered by this standard include printed circuit boards, cables, assemblies, and electronic products.
CRC - E9576 - ELECTRIC POWER DISTRIBUTION EQUIPMENT AND SYSTEMS Organization: CRC
Date: 2005-11-29
Description: Probing deeper into the system, individual chapters explore transformers, voltage regulation, and capacitor application in detail, from basic principles to operational considerations.
CRC - MULTILEVEL CONVERTERS FOR - MULTILEVEL CONVERTERS FOR INDUSTRIAL APPLICATIONS Organization: CRC
Date: 2017-07-12
Description: It then analyzes the topological characteristics of the diode-clamped multilevel converter, the flying capacitor multilevel converter, and the asymmetric cascaded multilevel converter.
DS/IEC PAS 63015 - DEFINITION OF "LOW-HALOGEN" FOR ELECTRONIC PRODUCTS Organization: DS
Date: 2017-06-19
Description: This standard may be applied to all nonmetallic and nonceramic materials within electronic products including, but not limited to, materials in the following components commonly found in electronic products: 1) transistors, integrated circuits, modules consisting mainly of integrated circuits (e.g. multichip, hybrid), and memory modules; 2) resistors, capacitors, relays, inductors, and connectors; 3) printed circuit board assemblies (PCBAs) including components; 4) plastic in cables, sockets, switches and external wiring; 5) mechanical plastics (enclosures, fans, etc.); 6) films, tapes, inks, and adhesives; 7) soldering flux residues (when present); 8) sound, shock, and vibration dampeners (foams, resins, etc.).
JEDEC/ECA JS709 - DEFINITION OF “LOW-HALOGEN” FOR ELECTRONIC PRODUCTS Organization: JEDEC
Date: 2015-04-01
Description: ., multichip, hybrid), and memory modules 2. Resistors, capacitors, relays, inductors, and connectors 3. Printed circuit board assemblies (PCBA's) including components 4.
IEC PAS 63015 - DEFINITION OF “LOW-HALOGEN” FOR ELECTRONIC PRODUCTS - EDITION 1.0 Organization: IEC
Date: 2016-06-01
Description: This standard may be applied to all nonmetallic and nonceramic materials within electronic products including, but not limited to, materials in the following components commonly found in electronic products: 1) transistors, integrated circuits, modules consisting mainly of integrated circuits (e.g. multichip, hybrid), and memory modules; 2) resistors, capacitors, relays, inductors, and connectors; 3) printed circuit board assemblies (PCBAs) including components; 4) plastic in cables, sockets, switches and external wiring; 5) mechanical plastics (enclosures, fans, etc.)

1 - 20 of 34 results