loading
IPC-A-600 - Acceptability of Printed Boards
July 1, 2020 - IPC

This document describes the target, acceptable, and nonconforming conditions that are either externally or internally observable on printed boards. It represents the visual interpretation of minimum requirements set forth in various printed board specifications, e.g.; IPC-6010 series,...

IPC-1752 - Materials Declaration Management Standard
June 1, 2020 - IPC

This standard establishes the requirements for exchanging material and substance data between suppliers and their customers for electrical and electronic products and other products. This standard applies to products, components, subproducts, complex objects, articles, materials, mixtures and...

IPC-TR-587 - Conformal Coating Material and Application ‘‘State of the Industry’’ Assessment Report
June 1, 2020 - IPC

Abstract Conformal coatings are thin layers of polymers applied to the surfaces of electronic assemblies, primarily to protect the electronics from the operational environment. In most manufacturing specifications, conformal coating thickness is defined as the thickness of the final polymer film on...

IPC-WP-025 - IPC White Paper on A Framework for the Engineering and Design of E-Textiles
April 1, 2019 - IPC

Introduction ''Very few users get deeply immersed in flexible circuit boards. It takes five to seven years working with it every day before you understand all the aspects of flexible circuit designs.'' - Mark Finstad, vice chair of the IPC D-11 Flexible Circuits Design...

IPC-9797 - Press-Fit Standard for Automotive Requirements and Other High-Reliability Applications
May 1, 2020 - IPC

This standard prescribes practices for the characterization, qualification and acceptance requirements of compliant press-fit technology for printed boards that cover the manufacturability and reliability needs for high reliability applications intended for use in harsh environments such as...

IPC-1602 - Standard for Printed Board Handling and Storage
April 1, 2020 - IPC

This standard provides requirements and recommendations for proper handling, packaging materials and methods, environmental conditions, and storage for printed boards. The requirements and recommendations are intended to protect printed boards from contamination, physical damage, solderability...

IPC-TM-650 2.6.7.2 - Thermal Shock, Thermal Cycle and Continuity
March 1, 2020 - IPC

This method subjects unpopulated test specimens (samples) to sudden, extreme changes in temperature in order to evaluate the quality of interconnects formed during the manufacturing processes. Purpose This method shall be used to simulate the thermodynamic effects of extreme temperature variations....

IPC-6012 GERMAN - Qualifikation und Leistungsspezifikation für starre Leiterplatten
March 1, 2020 - IPC
A description is not available for this item.
IPC-6012 CHINESE - Qualification and Performance Specification for Rigid Printed Boards
March 1, 2020 - IPC
A description is not available for this item.
IPC-TM-650 2.6.27 - Thermal Stress, Convection Reflow Assembly Simulation
February 1, 2020 - IPC

This method is intended to simulate exposure to the thermal conditions by convection reflow assembly. Purpose This method shall be used to replicate the thermodynamic effects by assembly on the test specimen. The use of this method is intended to simulate those effects that are the result of...

IPC/WHMA-A-620 - Requirements and Acceptance for Cable and Wire Harness Assemblies
January 1, 2020 - IPC

This standard prescribes practices and requirements for the manufacture of cable, wire and harness assemblies. This standard does not provide criteria for cross-section or X-ray evaluation. If a conflict occurs between the English and translated versions of this document, the English version will...

IPC-1791 - Trusted Electronic Designer, Fabricator and Assembler Requirements
January 1, 2020 - IPC

This standard provides minimum requirements, policies and procedures for printed board design, fabrication and assembly organizations and/or companies to become trusted sources for markets requiring high levels of confidence in the integrity of delivered products. These trusted sources shall ensure...

IPC-2591 - Connected Factory Exchange (CFX)
January 1, 2020 - IPC

This standard establishes the requirements for the omnidirectional exchange of information between manufacturing processes and associated host systems for assembly manufacturing. This standard applies to communication between all executable processes in the manufacture of printed board assemblies -...

IPC/WHMA-A-620 REDLINE - Requirements and Acceptance for Cable and Wire Harness Assemblies - Redline
January 1, 2020 - IPC

This standard prescribes practices and requirements for the manufacture of cable, wire and harness assemblies. This standard does not provide criteria for cross-section or X-ray evaluation. If a conflict occurs between the English and translated versions of this document, the English version will...

IPC-2223 - Sectional Design Standard for Flexible/Rigid-Flexible Printed Boards
January 1, 2020 - IPC

This standard establishes the specific requirements for the design of flexible and rigid-flexible printed board applications and its forms of component mounting and interconnecting structures. The flexible materials used in the structures are comprised of insulating films, reinforced and/or...

IPC-8921 - Requirements for Woven and Knitted Electronic Textiles (E-Textiles) Integrated with Conductive Fibers, Conductive Yarns and/or Wires
October 1, 2019 - IPC

This standard establishes the classification system as well as qualification and quality conformance requirements affecting electrical/electronic performance of woven and knitted electronic textiles (e-textiles) integrated with conductive fibers, conductive yarns and/or wires. This standard does...

IPC-WP-021 - Considerations of New Classes of Coatings for IPC-CC-830 Revision C
September 1, 2019 - IPC

Abstract For many years, conformal coatings used for high performance applications have been qualified to either the military standard for conformal coatings, MIL-I-46058, or the commercial equivalent, IPC-CC-830, which was almost identical to the military specification. Unfortunately, the...

IPC-HERMES-9852 - The Global Standard for Machine-to-Machine Communication in SMT Assembly
June 1, 2019 - IPC

The aim of this specification is to create a state-of-the-art communication protocol for surface-mount technology (SMT) production lines. Therefore, this new communication protocol has to cope with the following: • Replace the electrical SMEMA interface as specified in IPC-SMEMA-9851 •...

Advertisement