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CENELEC - EN 61189-5-4 - TEST METHODS FOR ELECTRICAL MATERIALS, PRINTED BOARDS AND OTHER INTERCONNECTION STRUCTURES AND ASSEMBLIES - PART 5-4: GENERAL TEST METHODS FOR MATERIALS AND ASSEMBLIES - SOLDER ALLOYS AND FLUXED AND NON-FLUXED SOLID WIRE FOR PRINTED BOARD ASSEMBLIES Organization: CENELEC
Date: 2015-03-01
Description: This part of IEC 61189 focuses on test methods for solder alloys, fluxed and non-fluxed solid wire, based on existing IEC 61189-5 and IEC 61189-6.
IEC 61189-5-4 - TEST METHODS FOR ELECTRICAL MATERIALS, PRINTED BOARDS AND OTHER INTERCONNECTION STRUCTURES AND ASSEMBLIES – PART 5-4: GENERAL TEST METHODS FOR MATERIALS AND ASSEMBLIES – SOLDER ALLOYS AND FLUXED AND NON-FLUXED SOLID WIRE FOR PRINTED BOARD ASSEMBLIES - EDITION 1.0 Organization: IEC
Date: 2015-01-01
Description: This part of IEC 61189 focuses on test methods for solder alloys, fluxed and non-fluxed solid wire, based on existing IEC 61189-5 and IEC 61189-6.
DS/EN 61189-5-4 - TEST METHODS FOR ELECTRICAL MATERIALS, PRINTED BOARDS AND OTHER INTERCONNECTION STRUCTURES AND ASSEMBLIES - PART 5-4: GENERAL TEST METHODS FOR MATERIALS AND ASSEMBLIES - SOLDER ALLOYS AND FLUXED AND NON-FLUXED SOLID WIRE FOR PRINTED BOARD ASSEMBLIES Organization: DS
Date: 2015-04-13
Description: This part of IEC 61189 focuses on test methods for solder alloys, fluxed and non-fluxed solid wire, based on existing IEC 61189-5 and IEC 61189-6.
CEI - EN 61189-5-4 - TEST METHODS FOR ELECTRICAL MATERIALS, PRINTED BOARDS AND OTHER INTERCONNECTION STRUCTURES AND ASSEMBLIES PART 5-4: GENERAL TEST METHODS FOR MATERIALS AND ASSEMBLIES - SOLDER ALLOYS AND FLUXED AND NON-FLUXED SOLID WIRE FOR PRINTED BOARD ASSEMBLIES Organization: CEI
Date: 2016-05-01
Description: This part of IEC 61189 focuses on test methods for solder alloys, fluxed and non-fluxed solid wire, based on existing IEC 61189-5 and IEC 61189-6.
DIN EN 61189-5-4 - TEST METHODS FOR ELECTRICAL MATERIALS, INTERCONNECTION STRUCTURES AND ASSEMBLIES - PART 5-4: TEST METHODS FOR PRINTED BOARD ASSEMBLIES: SOLDER ALLOYS AND FLUXED AND NON-FLUXED SOLID WIRE (IEC 91/1072/CD:2012) Organization: DIN
Date: 2013-07-01
AFNOR - NF EN 61189-5-4 - TEST METHODS FOR ELECTRICAL MATERIALS, PRINTED BOARDS AND OTHER INTERCONNECTION STRUCTURES AND ASSEMBLIES - PART 5-4 : GENERAL TEST METHODS FOR MATERIALS AND ASSEMBLIES - SOLDER ALLOYS AND FLUXED AND NON-FLUXED SOLID WIRE FOR WIRE FOR PRINTED BOARD ASSEMBIES Organization: AFNOR
Date: 2015-06-27
BSI - BS EN 61189-5-4 - TEST METHODS FOR ELECTRICAL MATERIALS, PRINTED BOARDS AND OTHER INTERCONNECTION STRUCTURES AND ASSEMBLIES PART 5-4: GENERAL TEST METHODS FOR MATERIALS AND ASSEMBLIES — SOLDER ALLOYS AND FLUXED AND NON-FLUXED SOLID WIRE FOR PRINTED BOARD ASSEMBLIES - CORR: APRIL 30, 2015 Organization: BSI
Date: 2015-01-31
BSI - BS IEC 61189-5-4 - TEST METHODS FOR ELECTRICAL MATERIALS, PRINTED BOARDS AND OTHER INTERCONNECTION STRUCTURES AND ASSEMBLIES PART 5-4: GENERAL TEST METHODS FOR MATERIALS AND ASSEMBLIES — SOLDER ALLOYS AND FLUXED AND NON-FLUXED SOLID WIRE FOR PRINTED BOARD ASSEMBLIES Organization: BSI
Date: 2015-01-31
TSE - TS EN 61189-5-4 - TEST METHODS FOR ELECTRICAL MATERIALS, PRINTED BOARDS AND OTHER INTERCONNECTION STRUCTURES AND ASSEMBLIES - PART 5-4: GENERAL TEST METHODS FOR MATERIALS AND ASSEMBLIES - SOLDER ALLOYS AND FLUXED AND NON-FLUXED SOLID WIRE FOR PRINTED BOARD ASSEMBLIES Organization: TSE
Date: 2015-04-30
Description: This part of IEC 61189 is a catalogue of test methodsrepresenting methodologi...
DIN EN 61189-5-4 - TEST METHODS FOR ELECTRICAL MATERIALS, PRINTED BOARDS AND OTHER INTERCONNECTION STRUCTURES AND ASSEMBLIES - PART 5-4: GENERAL TEST METHODS FOR MATERIALS AND ASSEMBLIES - SOLDER ALLOYS AND FLUXED AND NON-FLUXED SOLID WIRE FOR PRINTED BOARD ASSEMBLIES (IEC 61189-5-4:2015); GERMAN VERSION EN 61189-5-4:2015 Organization: DIN
Date: 2015-11-01
Description: Dieser Teil von IEC 61189 ist ein Katalog von Prüfverfahren, die methodische ...
JSA - JIS Z 3283 - RESIN FLUX CORED SOLDERS Organization: JSA
Date: 2017-03-21
Description: This Standard specifies resin flux cored solders made in a wire form incorporating in the centre a flux, which is used for wiring connections in electrical, electronic and communication devices and for manufacture of parts.
IPC - J-STD-004 - REQUIREMENTS FOR SOLDERING FLUXES - INCORPORATES AMENDMENT 1: NOVEMBER 2011 Organization: IPC
Date: 2008-12-01
Description: Soldering flux materials include the following: liquid flux, paste flux, solder paste, solder cream as well as flux-coated and flux-cored solder wires and preforms. It is not the intent of this standard to exclude any acceptable flux or soldering material; however, these materials must produce the desired electrical and metallurgical interconnection.
JSA - JIS Z 3197 - TEST METHODS FOR SOLDERING FLUXES Organization: JSA
Date: 2012-03-21
Description: ISO 9454-1: 1990 Soft soldering fluxes-Classification and requirementsPart 1: Classification, labelling and packaging ISO 9455-1: 1990 Soft soldering fluxes-Test methods-Part 1: Determination of non-volatile matter, gravimetric method ISO 9455-3: 1992 Soft soldering fluxes-Test methods-Part 3: Determination of acid value, potentiometric and visual titration methods ISO 9455-5: 1992 Soft soldering fluxes-Test methods-Part 5: Copper mirror test ISO 9455-6: 1995 Soft soldering fluxes-Test methods-Part 6: Determination and detection of halide (excluding fluoride) content ISO 9455-10: 1998 Soft soldering fluxes-Test methods-Part 10: Flux efficacy tests, solder spread method ISO 9455-13: 1996 Soft soldering fluxes-Test methods-Part 13: Determination of flux spattering ISO 9455-14: 1991 Soft soldering fluxes-Test methods-Part 14: Assessment of tackiness of flux residues ISO 9455-15: 1996 Soft soldering fluxes-Test methods-Part 15: Copper corrosion test ISO 9455-16: 1998 Soft soldering fluxes-Test methods-Part 16: Flux efficacy tests, wetting balance method ISO 9455-17: 2002 Soft soldering fluxes-Test methods-Part 17: Surface insulation resistance comb test and electrochemical migration test of flux residues ISO 12224-2: 1997 Flux cored solder wire-Specification and test methods- Part 2: Determination of flux content IEC 61189-5: 2006 Test methods for electrical materials, interconnection structures and assemblies-Part 5: Test methods for printed board assemblies IEC 61189-6: 2006 Test methods for electrical materials, interconnection structures and assemblies-Part 6: Test methods for materials used in manufacturing electronic assemblies IEC 61190-1-1: 2002 Attachment materials for electronic assemblyPart 1-1: Requirements for soldering fluxes for high-quality interconnections in electronics assembly (Overall evaluation: MOD) The symbols which denote the degree of correspondence in the contents between the relevant International Standards and JIS are IDT (identical), MOD (modified), and NEQ (not equivalent) according to ISOI/IEC Guide 21-1.
CEN - EN ISO 9455-14 - SOFT SOLDERING FLUXES - TEST METHODS - PART 14: ASSESSMENT OF TACKINESS OF FLUX RESIDUES Organization: CEN
Date: 2017-09-01
Description: The method is applicable to all fluxes, solder pastes and flux cored solder wires. The method is particularly appropriate for applications where flux residues are left in situ on electrical and electronic equipment
ISO 9455-14 - SOFT SOLDERING FLUXES - TEST METHODS - PART 14: ASSESSMENT OF TACKINESS OF FLUX RESIDUES - SECOND EDITION Organization: ISO
Date: 2017-08-01
Description: The method is applicable to all fluxes, solder pastes and flux cored solder wires. The method is particularly appropriate for applications where flux residues are left in situ on electrical and electronic equipment.
DS/EN ISO 9455-14 - SOFT SOLDERING FLUXES – TEST METHODS – PART 14: ASSESSMENT OF TACKINESS OF FLUX RESIDUES (ISO 9455-14:2017) Organization: DS
Date: 2017-09-25
Description: The method is applicable to all fluxes, solder pastes and flux cored solder wires. The method is particularly appropriate for applications where flux residues are left in situ on electrical and electronic equipment.
DIN EN ISO 9455-14 - SOFT SOLDERING FLUXES - TEST METHODS - PART 14: ASSESSMENT OF TACKINESS OF FLUX RESIDUES (ISO 9455-14:2017) Organization: DIN
Date: 2017-12-01
Description: The method is applicable to all fluxes, solder pastes and flux cored solder wires. The method is particularly appropriate for applications where flux residues are left in situ on electrical and electronic equipment.
ASTM B812 - STANDARD TEST METHOD FOR RESISTANCE TO ENVIRONMENTAL DEGRADATION OF ELECTRICAL PRESSURE CONNECTIONS INVOLVING ALUMINUM AND INTENDED FOR RESIDENTIAL APPLICATIONS Organization: ASTM
Date: 1996-05-10
Description: Environments encountered during construction or remodeling such as direct exposure to rain, uncured wet concrete, welding or soldering fluxes and other agents. This test method is limited to evaluation of pressure connection systems.
ASTM D4244 - STANDARD SPECIFICATION FOR GENERAL-PURPOSE, HEAVY-DUTY, AND EXTRA-HEAVY-DUTY ACRYLONITRILE-BUTADIENE/POLY(VINYL CHLORIDE) (NBR/PVC) JACKETS FOR WIRE AND CABLE Organization: ASTM
Date: 1995-02-15
Description: General-purpose and heavy-duty jackets are not recommended for installation at a temperature lower than −25°C and extra-heavy-duty jackets at a temperature lower than ×10°C. Compounds are based on a fluxed blend of an acrylonitrile-butadiene synthetic rubber and poly(vinyl chloride) resin.
IPC-C-103 - ELECTRONICS ASSEMBLY STANDARDS COLLECTION - TO PURCHASE HARDCOPY COMPILATION, CALL 1-800-854-7179 USA/CANADA OR 303-397-7956 WORLDWIDE. STANDARDS FROM THIS COMPILATION ARE AVAILABLE AS INDIVIDUAL DOCUMENTS IN IHS STANDARDS EXPERT. SEE DETAILS FOR ADDITIONAL INFORMATION. Organization: IPC
Date: 2008-06-01
Description: 2611: Generic Requirements for Electronic Product Documentation 2612: Sectional Requirements for Electronic Diagramming Documentation (schematic and Logic Description) 2612-1: Sectional Requirements for Electronic diagramming Synbol Generation Methodology 3406: Guidelines for Electrically Conductive Surface Mount Adhesives 3408: General Requirements for anisotropically Conductive Adhesives Films 7095B: Design and Assembly Process Implementation for BGAs 7351B: Generic Requirements for Surface Mount Design and Land Pattern Standard 9202: Material and Process Characterization/Qualifiaation Test Protocol and Assessing Electrochemical 9203: Users Guide to IPC-9202 and the IPC-B-52 Standard Test Vehicle 9701A: Performance Test Methods and Qualification Requirements for Surface Mount Soulder Attachements 9702: IPC/JEDEC Monotonic Bend Characterization of Board-Level Interconnects 9703: IPCJEDEC Mechanical Shock Test Guidelines for Solder Joint Reliability 9704A: Printed Circuit Assembly Strain Gage Test Guideline 9707: Spherical Bend Test Method for Characterization of Board Level Interconnects 9708: Test Methods for Charaterization of Printed Board Assembly Pad Cratering A-610E: Acceptability of Electronic Assemblies A-620A: Requirements and Acceptance for Cable and Wire Harness Assemblies A-620AS: Space Applications Electronic Hardware Addendum to IPC/WHMA-A-620A C-406: Design & Application Guidelines for Surface Mount Connectors CA-821: General Requirements for Thermally Conductive Adhesives CC-830B: Qualification and Performance of Electrical Insulating Compound for Printed Wiring Assembly CM-770E: Component Mounting Guidelines for Printed Boards D-326A: Information Requirements for Manufacturing Printed Circuit Boards and Other Electronic Assembly HDBK-001E: Handbook and Guide to Supplement J-STD-001 HDBK-005: Guide to Solder Paste Assessment JP002: JEDEC/IPC Current Tin Whiskers Theory and Mitigation Practices Guideline J-STD-001E: Requirements for Soldered Electrical and Electronic Assemblies J-STD-002C: Solderability Tests for Component Leads, Terminations, Lugs, Terminals and Wires J-STD-003B: Solderability Tests for Printed Boards J-STD-004B: Requirements for Soldering Fluxes J-STD-005A: Requirements for Soldering Pastes J-STD-006B: Requirements for Electronic Grade Solder Alloys and Fluxed and Non-Fluxed Solid Solders J-STD-012: Implementation of Flip Chip & Chip Scale Technology J-STD-020D-1: IPC/JEDEC Moisture/Reflow Sensitivity Classification for Nonhermetic Solid State Surf J-STD-027: Mechanical Outline Standard for Flip Chip and Chip Size Configureations J-STD-028: Performance Standard for Construction of Flip Chip and Chip Scale Bumps J-STD-030: Guideline for Selection and Application of Underfill Material for Flip Chip J-STD-033C: Handling, Packing, Shipping, and Use of Moisture/Reflow and/or Process Sensitie Components J-STD-075: Classification of Non-IC Electronic Components for Assembly Processes MC-790: Guidelines for Multichip Module Technolgy Utilization S-816: SMT Process Guideline & Checklist SM-780: Component Packaging & Interconnecting with Emphasis on Surface Mounting SM-784: Guidelines for Chip-on-Board Technoloty Implementation SM-785: Guidelines for Accelerated Reliability Testing of Surface Mount Attachments SM-817: General Requiremnts for Dielectric Surface Mounting Adhesives T-50J: Terms and Definitions for Interconnecting and Packaging Electronic Circuits TR-001: An Introduction to Tape Automated Bonding Fine Pitch Technology

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