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ASTM LEAD - ASTM STANDARDS ON LEAD HAZARDS ASSOCIATED WITH BUILDINGS
ASTM
A description is not available for this item.
AIHA LEAD PROBLEM - IS LEAD A PROBLEM IN MY HOUSE?
AIHA
A description is not available for this item.
JIS METAL SURFACE HDBK - JIS Metal Surface Treatment Handbook
January 1, 2018 - JSA
A description is not available for this item.
SSPC GUIDE 7 - GUIDE TO THE DISPOSAL OF LEAD-CONTAMINATED SURFACE PREPARATION DEBRIS
July 9, 2015 - SSPC

This guide provides information regarding handling, testing, and disposal of solid debris generated during preparation of surfaces previously painted with lead-containing paint. This guide is based on U.S. federal regulations only. States or other local jurisdictions may have...

MIL-PRF-19500/585 - DIODE, SILICON, ULTRA-FAST RECOVERY, POWER RECTIFIER, AXIAL LEAD THROUGH-HOLE AND SURFACE MOUNT PACKAGES, 1N6620 THROUGH 1N6625, JAN, JANTX, JANTXV, AND JANS
November 5, 2018 - NPFC

This specification covers the performance requirements for a silicon, ultra-fast recovery, semiconductor power rectifier diode. Four levels of product assurance are provided for each device type as specified in MIL-PRF-19500.

IEC 61837-2 - Surface mounted piezoelectric devices for frequency control and selection - Standard outlines and terminal lead connections - Part 2: Ceramic enclosures
May 1, 2018 - IEC

This part of IEC 61837 deals with standard outlines and terminal lead connections as they apply to surface-mounted devices (SMD) for frequency control and selection in ceramic enclosures, and is based on IEC 61240:2016.

DS/EN IEC 61837-2 - Surface mounted piezoelectric devices for frequency control and selection – Standard outlines and terminal lead connections – Part 2: Ceramic enclosures
July 17, 2018 - DS

IEC 61837-2:2018(E) deals with standard outlines and terminal lead connections as they apply to surface-mounted devices (SMD) for frequency control and selection in ceramic enclosures, and is based on IEC 61240:2016. This edition includes the following significant technical changes...

MIL-PRF-19500/575 - SEMICONDUCTOR DEVICE, DIODE, SILICON, HIGH VOLTAGE POWER RECTIFIER, FAST RECOVERY, AXIAL LEADED AND SURFACE MOUNT, TYPES 1N6512 THROUGH 1N6519 JAN, JANTX, JANTXV, AND JANS
June 26, 2017 - NPFC

This specification covers the performance requirements for silicon, high voltage, fast recovery power rectifier diodes. Four levels of product assurance are provided for each device as specified in MIL-PRF-19500.

DESC-DWG-88040 - RESISTOR, VARIABLE, SURFACE MOUNT, NONWIREWOUND, TRIMMER
July 13, 2018 - DOD

This drawing describes the requirements for a variable, surface mount, nonwirewound (adjustment type, lead screw actuated) resistor.

MIL-PRF-19500/586 - SEMICONDUCTOR DEVICE, DIODE, SILICON, SCHOTTKY BARRIER, ENCAPSULATED (AXIAL LEADED AND SURFACE MOUNT) AND UNENCAPSULATED, TYPES 1N5817–1, 1N5819–1, AND 1N6761–1, QUALITY LEVELS JAN, JANTX, JANTXV, JANS, JANHC, AND JANKC
December 15, 2017 - NPFC

This specification covers the performance requirements for silicon, Schottky barrier diodes. Four levels of product assurance (JAN, JANTX, JANTXV, and JANS) are provided for each encapsulated device types as specified in MIL-PRF-19500. Two levels of product assurance (JANHC and JANKC) are provided...

MIL-PRF-19500/435 - SEMICONDUCTOR DEVICE, DIODE, SILICON, LOW-NOISE VOLTAGE REGULATOR, ENCAPSULATED (AXIAL LEAD THROUGH-HOLE AND SURFACE MOUNT PACKAGES) AND UN-ENCAPSULATED (DIE), TYPES 1N4099 THROUGH 1N4135, 1N4614 THROUGH 1N4627, C AND D TOLERANCE SUFFIX DEVICES, JAN, JANTX, JANTXV, JANS, JANHC, AND JANKC
November 1, 2018 - NPFC

This specification covers the performance requirements for 500 milliwatt, silicon, low-noise, voltage regulator diodes with voltage tolerances of 5 percent, 2 percent, and 1 percent. Four levels of product assurance (JAN, JANTX, JANTXV, and JANS) are provided for each encapsulated device. Two...

JEDEC JESD 22-B105 - Lead Integrity
February 1, 2018 - JEDEC

This test method provides various test conditions for determining the integrity of the lead/package interface and the lead itself when the lead(s) are bent due to faulty board assembly processing followed by rework of the part for reassembly. For hermetic packages hermeticity...

MIL-PRF-19500/516 - SEMICONDUCTOR DEVICE, DIODE SILICON, BIPOLAR TRANSIENT VOLTAGE SUPPRESSOR, ENCAPSULATED (AXIAL LEAD THROUGH-HOLE AND SURFACE MOUNT PACKAGES) AND UN-ENCAPSULATED (DIE), TYPES 1N6102 THROUGH 1N6173, JAN, JANTX, JANTXV, JANS, JANHC, AND JANKC
February 22, 2018 - NPFC

This specification covers the performance requirements for bipolar 500 watt and 1,500 watt peak pulse power transient voltage suppressor diodes. Four levels of product assurance (JAN, JANTX, JANTXV, and JANS) are provided for each encapsulated device. Two levels of product assurance (JANHC and...

SAE AMS7721 - Lead Alloy Sheet and Extrusions 93Pb - 6.5Sb - 0.50Sn As Fabricated
February 1, 2018 - SAE

Form This specification covers a lead alloy in the form of sheet and extrusions. Application This products have been used typically for balance weights in airframe control surfaces and control columns, but usage is not limited to such applications.

MIL-PRF-19500/609 - SEMICONDUCTOR DEVICE, DIODE, SILICON, SWITCHING, AXIAL LEADED AND SURFACE MOUNT PACKAGES, TYPES 1N6639, 1N6640, 1N6641, JAN, JANTX, JANTXV, JANS, JANHC, AND JANKC
June 30, 2016 - NPFC

This specification covers the performance requirements for controlled forward voltage switching diodes. Four levels of product assurance (JAN, JANTX, JANTXV, and JANS) are provided for each device type as specified in MIL-PRF-19500. Two levels of product assurance JANHC and JANKC are provided for...

ASTM E2271/E2271M - Standard Practice for Clearance Examinations Following Lead Hazard Reduction Activities in Multifamily Dwellings
April 1, 2018 - ASTM

This practice covers visual assessment for the presence of deteriorated paint, surface dust, painted debris, and paint chips with environmental sampling of surface dust to determine whether a lead hazard exists at the time of sample collection, following lead-hazard...

ISO DIS 22908 - Water quality - Radium 226 and radium 228 - Test method using liquid scintillation counting
August 24, 2018 - ISO

The document specifies the determination of radium-226 (226Ra) and radium-228 (228Ra) activity concentrations in drinking water samples by chemical separation of radium and its measurement using liquid scintillation counting. 226Ra and 228Ra are present in the environment as radionuclides from the...

ASTM F2873 - Standard Practice for the Installation of Self-Leveling Underlayment and the Preparation of Surface to Receive Resilient Flooring
July 15, 2018 - ASTM

This practice covers the installation of self-leveling underlayments, which may include a priming system, over solid wood, wood structural panel subfloors, over concrete, and over certain solidly bonded existing flooring systems such as epoxy floors, ceramic and natural stone tiles, terrazzo, metal...

Kali Linux Web Penetration Testing Cookbook
August 31, 2018 - PACKT

Discover the most common web vulnerabilities and prevent them from becoming a threat to your site's security Key Features *Familiarize yourself with the most common web vulnerabilities *Conduct a preliminary assessment of attack surfaces and run exploits in your lab *Explore new tools in the...

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