loading
ASTM PACKAGING - ASTM PACKAGING STANDARDS AND RELATED TECHNICAL MATERIAL
ASTM
A description is not available for this item.
SEMI PACKAGING - PACKAGING
SEMI
A description is not available for this item.
FORD PACKAGING GUIDELINES - PACKAGING GUIDELINES FOR PRODUCTION PARTS
July 1, 1997 - FORD
A description is not available for this item.
IEEE CIRCUITS AND FILTERS - THE CIRCUITS AND FILTERS HANDBOOK
IEEE
A description is not available for this item.
ASTM D578/D578M-23 - Standard Specification for Glass Fiber Strands
June 1, 2023 - ASTM International

1.1 This specification covers the requirements for continuous fiber and staple fiber glass strands, including single, plied and multiple wound. It also covers textured glass fiber yarns. This specification is intended to assist ultimate users by designating the general nomenclature for the strand...

QML-31032 - Printed Circuit Board/Printed Wiring Board, General Specification for
April 8, 2021 - NPFC

QUALIFIED PRODUCT LIST OF PRODUCTS QUALIFIED UNDER PERFORMANCE SPECIFICATION MIL-PRF-31032 Printed Circuit Board/Printed Wiring Board, General Specification for This list has been prepared for use by or for the Government in the acquisition of products covered by...

IPC-1602 - Standard for Printed Board Handling and Storage
April 1, 2020 - IPC

This standard provides requirements and recommendations for proper handling, packaging materials and methods, environmental conditions, and storage for printed boards. The requirements and recommendations are intended to protect printed boards from contamination, physical...

J1742_202208 - Connections for High Voltage On-Board Vehicle Electrical Wiring Harnesses - Test Methods and General Performance Requirements
August 5, 2022 - SAE International

Procedures included within this specification are intended to cover performance testing at all phases of development, production, and field analysis of electrical terminals, connectors, and components that constitute the electrical connection systems in high power road vehicle applications that...

IEC TR 61191-8 - Printed board assemblies – Part 8: Voiding in solder joints of printed board assemblies for use in automotive electronic control units – Best practices
March 1, 2021 - IEC

This part of IEC 61191gives guidelines for dealing with voiding in surface-mount solder joints of printed board assemblies for use in automotive electronics. This technical report focuses exclusively on voids in solder joints connecting packaged electronic or electromechanical...

ASTM B885-09(2020) - Standard Test Method for Presence of Foreign Matter on Printed Wiring Board Contacts
October 1, 2020 - ASTM International

5.1 This test method provides a way to detect contamination on printed wiring board fingers that affects the electrical performance of such fingers. Such contamination may arise during PWB manufacture, circuit assembly, or service life and may include solder mask, solder flux,...

IEEE 370 - Electrical Characterization of Printed Circuit Board and Related Interconnects at Frequencies up to 50 GHz
September 24, 2020 - IEEE

This document addresses the quality of measured S-parameters for electrical printed circuit board (PCB) and related interconnect at frequencies up to 50 GHz. This might include, but is not limited to: test fixtures, as well as methods and processes for controlling the accuracy...

QPL-32385 - Connector, Receptacles, Plugs, Adapter, Used on Electroluminescent, Embedded, and Printed Circuit Board Lamp Lighting Panels General Specification for
February 4, 2021 - NPFC

QUALIFIED PRODUCT LIST OF PRODUCTS QUALIFIED UNDER PERFORMANCE SPECIFICATION MIL-DTL-32385 Connector, Receptacles, Plugs, Adapter, Used on Electroluminescent, Embedded, and Printed Circuit Board Lamp Lighting Panels General Specification for This list has been prepared for use...

IEEE 2401 - Standard Format for LSI-Package- Board Interoperable Design
November 7, 2019 - IEEE

This standard defines a common interoperable format that will be used for the design of a) large-scale integration (LSI), b) packages for such LSI, and c) printed circuit boards on which the packaged LSIs are interconnected. Collectively, such designs are referred to as...

IPC-2222 - Sectional Design Standard for Rigid Organic Printed Boards
October 1, 2020 - IPC

This standard establishes the specific requirements for the design of rigid organic printed boards. The following overview describes what are the core knowledge and competencies to best serve in the role of Printed Board Design Layout as a stand-alone professional, or as the...

DS/ISO 8092-5 - Road vehicles – Connections for on-board electrical wiring harnesses – Part 5: Test methods and general performance requirements for wiring harness connector operation
January 28, 2021 - DS

This document defines terms and specifies test methods and general performance requirements for single-pole and multi-pole connections used with on-board electrical wiring harnesses of road vehicles. This document is applicable to connectors designed to be disconnected after mounting in the...

IEC 62148-15 - Fibre optic active components and devices – Package and interface standards – Part 15: Discrete vertical cavity surface emitting laser packages
March 1, 2021 - IEC

This part of IEC 62148 covers the physical dimension and interface specifications for discrete vertical cavity surface emitting laser (VCSEL) devices in optical telecommunication and optical data transmission applications. The intent of this document is to adequately specify the physical...

IEC 62148-15 REDLINE - Fibre optic active components and devices – Package and interface standards – Part 15: Discrete vertical cavity surface emitting laser packages
March 1, 2021 - IEC

This part of IEC 62148 covers the physical dimension and interface specifications for discrete vertical cavity surface emitting laser (VCSEL) devices in optical telecommunication and optical data transmission applications. The intent of this document is to adequately specify the physical...

JIS PACKAGING HDBK - JIS Packaging Handbook
January 1, 2016 - JSA
A description is not available for this item.
GSFC-STD-8001 - Standard Quality Assurance Requirements for Printed Circuit Boards
November 21, 2019 - NASA

Purpose The purpose of this standard is to provide requirements and recommendations that ensure that high-reliability printed circuit boards (PCBs) are designed, procured, produced and used in GSFC project mission hardware. Applicability The requirements herein apply across the full...

Advertisement