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This standard is a collection of visual quality acceptability criteria for solder paste printing. Purpose The purpose of this guideline document is to support the user in the visual evaluation of the solder paste printing process, which makes subsequent process...
This Japanese Industrial Standard specifies the characteristics test methods for solder paste using fine solder particles with a particle size of symbol 7 and symbol 8 specified in JIS Z 3284-1 (hereafter referred to as solder paste), mainly intended for...
This test is to determine the ability of a printed pattern of solder paste to retain a probe placed in the solder paste by measuring the force required to separate the probe from the paste. Time between printing and probe placement are progressively increased to...
This handbook is a companion to the solder paste standard J-STD-005 and should be considered to be a guide to help assess the applicability of a solder paste for its use in surface mount technology (SMT) processes. This document also suggests some test methods that can...
This standard prescribes general requirements for the characterization and testing of solder pastes used to make high quality electronic interconnections. This specification is a material quality control document and is not intended to relate directly to the material's performance in...
1 Scope This specification is inactive with no replacement.
This part of IEC 61189 specifies methods for testing the characteristics of soldering paste using fine solder particles (hereinafter referred to as solder paste). This document is applicable to the solder paste using fine solder particle such...
The materials defined by these specifications are 10 Sn/88 Pb/2 Ag solder pastes with mildly activated rosin flux used for either screen printing, stencil printing or syringe dispensing applications. These solder pastes are homogeneous suspensions of prealloyed...
The material defined by this specification is a self-fluxing solder paste.
