Printed board assemblies – Part 3: Sectional specification – Requirements for through-hole mount soldered assemblies
|Publication Date:||1 May 2017|
|ICS Code (Mechanical structures for electronic equipment):||31.240|
This part of IEC 61191 prescribes requirements for lead and hole solder assemblies. The requirements pertain to those assemblies that totally use through-hole mounting technology (THT), or the THT portions of those assemblies that include other related technologies (i.e. surface mount, chip mounting, terminal mounting).