IEC 61191-4
Printed board assemblies - Part 4: Sectional specification - Requirements for terminal soldered assemblies
Organization: | IEC |
Publication Date: | 1 July 2017 |
Status: | active |
Page Count: | 24 |
ICS Code (Mechanical structures for electronic equipment): | 31.240 |
scope:
This part of IEC 61191 prescribes requirements for terminal soldered assemblies. The requirements pertain to those assemblies that are entirely terminal/wire interconnecting structures or to the terminal/wire portions of those assemblies that include other related technologies (i.e. surface mounting, through-hole mounting, chip mounting).