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JSA - JIS Z 3282

Soft solders - Chemical compositions and forms

active, Most Current
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Organization: JSA
Publication Date: 21 March 2017
Status: active
Page Count: 22
ICS Code (Brazing and soldering): 25.160.50
scope:

This Standard specifies lead-containing soft solders used in the field of general or electric/electronic industries (hereafter referred to as lead-containing solders) and soft solders not containing lead (hereafter referred to as lead-free solders).

NOTE: The International Standards corresponding to this Standard and the symbol of degree of correspondence are as follows.

ISO 9453: 2014 Soft solder alloys-Chemical compositions and forms

lEC 61190-1-3: 2010 Attachment materials for electronic assemblyPart 1-3: Requirements for electronic grade solder alloys and fluxed and non-fluxed solid solders for electronic soldering applications (overall evaluation: MOD)

In addition, symbols which denote the degree of correspondence in the contents between the relevant International Standard and JIS are IDT (identical), MOD (modified), and NEQ (not equivalent) according to ISO/ IEC Guide 21-1.

Document History

JIS Z 3282
March 21, 2017
Soft solders - Chemical compositions and forms
This Standard specifies lead-containing soft solders used in the field of general or electric/electronic industries (hereafter referred to as lead-containing solders) and soft solders not containing...
March 25, 2006
Soft Solders - Chemical Compositions and Forms
A description is not available for this item.
March 20, 1999
Soft Solders - Chemical Compositions and Forms
A description is not available for this item.
January 1, 1986
Soft Solder
A description is not available for this item.

References

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