CENELEC - EN 61191-2
Printed board assemblies - Part 2: Sectional specification - Requirements for surface mount soldered assemblies
active, Most Current
| Organization: | CENELEC |
| Publication Date: | 1 October 2017 |
| Status: | active |
| Page Count: | 40 |
| ICS Code (Electronic component assemblies): | 31.190 |
| ICS Code (Mechanical structures for electronic equipment): | 31.240 |
scope:
This part of IEC 61191 gives the requirements for surface mount solder connections. The requirements pertain to those assemblies that are totally surface mounted or to the surface mounted portions of those assemblies that include other related technologies (e.g. throughhole, chip mounting, terminal mounting, etc.).
Document History
EN 61191-2
October 1, 2017
Printed board assemblies - Part 2: Sectional specification - Requirements for surface mount soldered assemblies
This part of IEC 61191 gives the requirements for surface mount solder connections. The requirements pertain to those assemblies that are totally surface mounted or to the surface mounted portions of...
October 1, 2013
Printed board assemblies - Part 2: Sectional specification - Requirements for surface mount soldered assemblies
This part of IEC 61191 gives the requirements for surface mount solder connections. The requirements pertain to those assemblies that are totally surface mounted or to the surface mounted portions of...
October 1, 1998
Printed Board Assemblies Part 2: Sectional Specification Requirements for Surface Mount Soldered Assemblies
A description is not available for this item.