IPC - TM-650 2.6.11D
Solder Mask - Hydrolytic Stability
active, Most Current
| Organization: | IPC |
| Publication Date: | 1 March 2007 |
| Status: | active |
| Page Count: | 1 |
scope:
This test method is used to determine the resistance of the applied solder mask to reverting to liquid when exposed to high humidity at a specific time and temperature condition. This test method evaluates the stability of a cured solder mask that has been applied to a printed board under storage (nonoperating) conditions.
Document History
TM-650 2.6.11D
March 1, 2007
Solder Mask - Hydrolytic Stability
This test method is used to determine the resistance of the applied solder mask to reverting to liquid when exposed to high humidity at a specific time and temperature condition. This test method...
July 1, 2000
Hydrolytic Stability Solder Mask
A description is not available for this item.
August 1, 1998
Hydrolytic Stability Solder Mask and Conformal Coatings
A description is not available for this item.
November 1, 1988
Hydrolytic Stability Solder Mask and Conformal Coatings
A description is not available for this item.