scope:

IPC-C-105 is a hardcopy compilation of IPC documents on Rigid Board Standards. Documents were reviewed and recommended for inclusion by IPC's technical staff.

These IPC documents can be viewed individually through the appropriate IPC subscriptions in IHS Standards Expert

1601: Printed Board Handling and Storage Guidelines

2152: Standard for Determining Current Carrying Capacity in Printed Board Design

2221B: Generic Standard on Printed Board Design

2222A: Sectional Design Standard on Rigid Organic Printed Boards

2226: Sectional Design Standard for High Density Interconnect (HDI) Boards

2251: Design Guide for the Packaging of High Speed Electronic Circuits

2252: Design Fuide fore RF/Microwave Circuit Boards

2316: Design Guide for Embedded Passive Device Printed Boards

2611: Generic Requirements for Electronic Product Documentation

2614: Sectional Requirements for Board Fabrication Documentation

2615: Printed Board Dimensions and Tolerances

4101C: Specification for Base Materials for Rigid and Multilayer Printed Boards

4103A: Specification for Base Materials for High Speed/High Frequency Applications

4412A: Specification for Finished Fabric Woven from "E" Glass for Printed Boards - Includes Amendments

4552: Specificaion for Electroless Nickel/Immersion Gold (ENIG) Plating for Printed Circuit Boards

4553A: Specification for Immersion Silver Plating for Printed Boards

4554: Specification for Immersion Tin Plating for printed Circuit Boards

4562A: Metal Foil for Printed Board Applications

4563: Resin Coated Copper Foil for Printed Boards Guideline

4761: Design Guide for Protection of Printed Board Via Structures

4781: Qualification and Performance Specification of Permanent, Semi-Permanent and Temporary Legend

4811: Specification for Embedded Passive Device Resistor Materials for Rigid and Multilayer Printed

4821: Specification for Embedded Passive Device Capacitor Materials for Rigid and Multilayer Printed

6011: Generic Performance Specification for Printed Boards

6012C: Qualification and Performance Specification for Rigid Printed Boards

6017: Qualification and Performance Specification for printed Boards Containing Embedded Passive

6018B: Qualification and Performance Specification for High Frequency (Microwave) Printed Boards

7351B: Generic Requirements for Surface Mount Design and Land Pattern Standard

9252A: Requirements for Electrical Testing of Unpopulated Printed Boards

9691A: User Guide for the IPC-TM-650, Method 2.6.25, Conductive Anodic Filament (CAF) Resistance Test

A-600H: Acceptability of Printed Boards

D-325A: Documentation Requirements for Printed Boards

DR-570A: General Specification for 1/8 inch Diameter Shank Carbide Drills for Printed Boards

DR-572A: Drilling Guidelines for Printed Boards

JP002: JEDEC/IPC Current Tin Whiskers Theory and Mitigation Practices Guideline

J-STD-003B: Solderability Tests for Printed Boards

ML-960: Qualification and Performance Specification for Mass Lamination Panels for Multilayer Print

MA-810: Guidelines for High Volume Microsection

SM-840E: Qualification and Performance Specification of Permanent Solder Mask and Flexible Cover Mat

T-50J: Terms and Definitions for Interconnecting and Packaging Electronic Circuits

TR-486: Report on Round Robin Study to Correlate Interconnect Stress Test (IST) with Thermal Stress

TR-579: Round Robin Reliability Evaluation of Smalll Diameter Plated Through Holes in PWBs

WP/TR-584A: IPC White Pater and Technical Report on the Use of Halogenated Flame Retardants in Print