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CEI EN IEC 60286-3

Packaging of components for automatic handling Part 3: Packaging of surface mount components on continuous tapes

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Organization: CEI
Publication Date: 1 June 2019
Status: active
Page Count: 50
ICS Code (Electronic components in general): 31.020
ICS Code (Mechanical structures for electronic equipment): 31.240
scope:

This part of IEC 60286 is applicable to the tape packaging of electronic components without leads or with lead stumps, intended to be connected to electronic circuits. It includes only those dimensions that are essential for the taping of components intended for the abovementioned purposes.

This document also includes requirements related to the packaging of singulated die products including bare die and bumped die (flip chips).

Document History

CEI EN IEC 60286-3
June 1, 2019
Packaging of components for automatic handling Part 3: Packaging of surface mount components on continuous tapes
This part of IEC 60286 is applicable to the tape packaging of electronic components without leads or with lead stumps, intended to be connected to electronic circuits. It includes only those...
April 1, 2014
Packaging of components for automatic handling Part 3: Packaging of surface mount components on continuous tapes
This part of IEC 60286 is applicable to the tape packaging of electronic components without leads or with lead stumps, intended to be connected to electronic circuits. It includes only those...
April 1, 2008
Packaging of components for automatic handling - Part 3: Packaging of surface mount components on continuous tapes
La presente Norma fa parte della serie 60286 che si occupa del confezionamento di componenti per il trattamento automatico sulle linee di produzione. In particolare questa norma tratta gli aspetti...
November 1, 1999
Confezione di componenti per inserzione automatica - Parte 3: Confezione di componenti per montaggio superficiale su nastro continuo
La presente Norma si applica al confezionamento su nastro di componenti elettronici senza reofori o con forme di reofori destinati ad essere collegati a circuiti elettronici. La presente EN viene...

References

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