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BSI - BS EN 60749-21

Semiconductor devices - Mechanical and climatic test methods Part 21: Solderability

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Organization: BSI
Publication Date: 31 August 2011
Status: active
Page Count: 26
ICS Code (Other standards related to lamps): 29.140.99
ICS Code (Semiconductor devices in general): 31.080.01

Document History

BS EN 60749-21
August 31, 2011
Semiconductor devices - Mechanical and climatic test methods Part 21: Solderability
A description is not available for this item.
BS EN 60749-21
December 5, 2005
Semiconductor devices - Mechanical and climatic test methods - Part 21: Solderability
A description is not available for this item.

References

This document references:
IEC 61190-1-2 - Attachment materials for electronic assembly – Part 1-2: Requirements for soldering pastes for high-quality interconnects in electronics assembly
Published by IEC on February 1, 2014
A description is not available for this item.
This document references:
IEC 61190-1-3 - Attachment materials for electronic assembly – Part 1-3: Requirements for electronic grade solder alloys and fluxed and nonfluxed solid solder for electronic soldering applications
Published by IEC on December 1, 2017
This part of IEC 61190 prescribes the requirements and test methods for electronic grade solder alloys, for fluxed and non-fluxed bar, ribbon, powder solders and solder paste, for electronic...
This document references:
IEC 60749-15 - Semiconductor devices – Mechanical and climatic test methods – Part 15: Resistance to soldering temperature for through-hole mounted devices
Published by IEC on July 1, 2020
This part of IEC 60749 describes a test used to determine whether encapsulated solid state devices used for through-hole mounting can withstand the effects of the temperature to which they are...
This document references:
IEC 60068-2-69 - Environmental testing – Part 2-69: Tests – Test Te/Tc: Solderability testing of electronic components and printed boards by the wetting balance (force measurement) method
Published by IEC on June 1, 2019
This part of IEC 60068 outlines test Te/Tc, the solder bath wetting balance method and the solder globule wetting balance method to determine, quantitatively, the solderability of the terminations....
This document is referenced by:
BS EN 60747-15 - Semiconductor devices - Discrete devices - Part 15: Isolated power semiconductor devices
Published by BSI on April 30, 2012
A description is not available for this item.
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