BSI - BS EN IEC 62878-2-5
Device embedding assembly technology Part 2-5: Guidelines — Implementation of a 3D data format for device embedded substrate
active, Most Current
Buy Now
| Organization: | BSI |
| Publication Date: | 30 November 2019 |
| Status: | active |
| Page Count: | 58 |
| ICS Code (Electronic component assemblies): | 31.190 |
| ICS Code (Printed circuits and boards): | 31.180 |
Document History
BS EN IEC 62878-2-5
November 30, 2019
Device embedding assembly technology Part 2-5: Guidelines — Implementation of a 3D data format for device embedded substrate
A description is not available for this item.
August 31, 2015
Device embedded substrate — Guidelines — Data format
A description is not available for this item.