Soft solder alloys — Chemical compositions and forms
|Publication Date:||1 September 2020|
|ICS Code (Brazing and soldering):||25.160.50|
This document specifies the requirements for chemical composition for soft solder alloys containing two or more of: tin, lead, antimony, copper, silver, bismuth, zinc, indium and/or cadmium.
An indication of the forms generally available is also included.