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ISO 9453

Soft solder alloys — Chemical compositions and forms

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Organization: ISO
Publication Date: 1 September 2020
Status: active
Page Count: 20
ICS Code (Brazing and soldering): 25.160.50
scope:

This document specifies the requirements for chemical composition for soft solder alloys containing two or more of: tin, lead, antimony, copper, silver, bismuth, zinc, indium and/or cadmium.

An indication of the forms generally available is also included.

Document History

ISO 9453
September 1, 2020
Soft solder alloys — Chemical compositions and forms
This document specifies the requirements for chemical composition for soft solder alloys containing two or more of: tin, lead, antimony, copper, silver, bismuth, zinc, indium and/or cadmium. An...
ISO 9453
August 1, 2014
Soft solder alloys - Chemical compositions and forms
WARNING — National or regional regulations may limit the employment of certain alloys. This International Standard specifies the requirements for chemical composition for soft solder alloys...
ISO 9453
October 1, 2006
Soft Solder Alloys - Chemical Compositions and Forms
A description is not available for this item.
ISO 9453
January 1, 1990
Soft Solder Alloys - Chemical Compositions and Forms First Edition (CEN EN 29453: 1993)
A description is not available for this item.

References

This document references:
IEC 61190-1-3 - Attachment materials for electronic assembly – Part 1-3: Requirements for electronic grade solder alloys and fluxed and nonfluxed solid solder for electronic soldering applications
Published by IEC on December 1, 2017
This part of IEC 61190 prescribes the requirements and test methods for electronic grade solder alloys, for fluxed and non-fluxed bar, ribbon, powder solders and solder paste, for electronic...
This document references:
ISO 3677 - Filler metal for soldering and brazing - Designation
Published by ISO on September 15, 2016
This International Standard specifies designations for filler materials for soldering and brazing, on the basis of their chemical composition. For brazing materials only, the designation includes...
This document is referenced by:
BS EN ISO 9455-13 - Soft Soldering Fluxes - Test Methods Part 13: Determination of Flux Spattering
Published by BSI on October 31, 2017
A description is not available for this item.
This document is referenced by:
BS EN 60068-2-69 - Environmental testing Part 2-69 - Tests – Test Te/Tc: Solderability testing of electronic components and printed boards by the wetting balance (force measurement) method
Published by BSI on July 31, 2017
A description is not available for this item.
This document is referenced by:
SN EN ISO 9455-16 - Soft soldering fluxes - Test methods - Part 16: Flux efficacy test, wetting balance method
Published by SNV on June 1, 2020
This document specifies a method for the assessment of the efficacy of a soft soldering flux, known as the wetting balance method. It gives a qualitative assessment of the comparative efficacy of two...
This document is referenced by:
BS EN IEC 61191-1 - Printed Board Assemblies Part 1: Generic Specification - Requirements for Soldered Electrical and Electronic Assemblies Using Surface Mount and Related Assembly Technologies
Published by BSI on November 30, 2018
A description is not available for this item.
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