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BSI - BS EN IEC 61760-1

Surface Mounting Technology Part 1: Standard method for the specification of surface mounting components (SMDs)

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Organization: BSI
Publication Date: 30 September 2020
Status: active
Page Count: 50
ICS Code (Electronic components in general): 31.020
ICS Code (Mechanical structures for electronic equipment): 31.240

Document History

BS EN IEC 61760-1
September 30, 2020
Surface Mounting Technology Part 1: Standard method for the specification of surface mounting components (SMDs)
A description is not available for this item.
BS EN 61760-1
September 29, 2006
Surface Mounting Technology - Part 1: Standard Method for the Specification of Surface Mounting Components (SMDs)
A description is not available for this item.
BS EN 61760-1
January 15, 1999
Surface Mounting Technology - Part 1: Standard Method for the Specification of Surface Mounting Components (SMDs)
Gives a reference set of process conditions and related test conditions to be used when compiling component specifications.

References

This document references:
EN 60062 - Marking codes for resistors and capacitors
Published by CENELEC on October 1, 2016
This International Standard specifies designation and marking codes for capacitors and resistors. It provides coding methods for the resistance or capacitance value and its tolerance, including...
This document references:
EN 60068-1 - Environmental testing - Part 1: General and guidance
Published by CENELEC on March 1, 2014
A description is not available for this item.
This document references:
EN 60068-2-2 - Environmental testing - Part 2-2: Tests - Test B: Dry heat
Published by CENELEC on September 1, 2007
A description is not available for this item.
This document references:
EN 60068-2-58 - Environmental testing - Part 2-58: Tests - Test Td: Test methods for solderability, resistance to dissolution of metallization and to soldering heat of surface mounting devices (SMD)
Published by CENELEC on May 1, 2015
This part of IEC 60068 outlines test Td, applicable to surface mounting devices (SMD). This document provides procedures for determining the solderability, resistance to dissolution of metallization...
This document references:
EN 60068-2-69 - Environmental testing - Part 2-69: Tests - Test Te/Tc: Solderability testing of electronic components and printed boards by the wetting balance (force measurement) method
Published by CENELEC on June 1, 2017
This part of IEC 60068 outlines test Te/Tc, the solder bath wetting balance method and the solder globule wetting balance method to determine, quantitatively, the solderability of the terminations....
This document is referenced by:
BS EN 60512-16-21 - Connectors for electronic equipment - Tests and measurements Part 16-21: Mechanical tests on contacts and terminations - Test 16u: Whisker test via the application of external mechanical stresses
Published by BSI on July 31, 2012
A description is not available for this item.
This document is referenced by:
BS EN 60115-8 - Fixed resistors for use in electronic equipment Part 8: Sectional specification - Fixed surface mount resistors
Published by BSI on December 31, 2012
A description is not available for this item.
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