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IPC-4554

Specification for Immersion Tin Plating for Printed Circuit Boards

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Organization: IPC
Publication Date: 1 January 2007
Status: active
Page Count: 56
scope:

This specification sets the requirements for the use of Immersion Tin (ISn) as a surface finish for printed circuit boards. It is intended for use by supplier, manufacturer, contract manufacturer (CM) and original equipment manufacturer (OEM).

Document History

IPC-4554
January 1, 2007
Specification for Immersion Tin Plating for Printed Circuit Boards
This specification sets the requirements for the use of Immersion Tin (ISn) as a surface finish for printed circuit boards. It is intended for use by supplier, manufacturer, contract manufacturer...
IPC-4554
January 1, 2007
Specification for Immersion Tin Plating for Printed Circuit Boards
This specification sets the requirements for the use of Immersion Tin (ISn) as a surface finish for printed circuit boards. It is intended for use by supplier, manufacturer, contract manufacturer...

References

This document references:
IPC-2221 - Generic Standard on Printed Board Design
Published by IPC on June 1, 2018
A description is not available for this item.
This document references:
IPC-6012 - Qualification and Performance Specification for Rigid Printed Boards
Published by IPC on March 1, 2020
Statement of Scope This specification establishes and defines the qualification and performance requirements for the fabrication of rigid printed boards. Purpose The purpose of this specification is...
This document references:
TM-650 2.6.14.1 - Electrochemical Migration Resistance Test
Published by IPC on September 1, 2000
This test method provides a means to assess the propensity for surface electrochemical migration. This test method can be used to assess soldering materials and/or processes.
This document references:
IPC-TM-650 2.6.3.5 - Bare Board Cleanliness by Surface Insulation Resistance
Published by IPC on January 1, 2004
This test method is used to characterize the cleanliness of printed wiring board fabrication processes by determining the degradation of electrical insulation resistance under conditions of high...
This document references:
IPC-TM-650 2.4.1 - Adhesion, Tape Testing
Published by IPC on May 1, 2004
This test method uses pressure sensitive tape to determine the adhesion quality of platings, marking inks or paints, and other materials used in conjunction with Printed Boards.
This document references:
IPC-2221 - Generic Standard on Printed Board Design
Published by IPC on June 1, 2018
A description is not available for this item.
This document references:
IPC-6012 - Qualification and Performance Specification for Rigid Printed Boards
Published by IPC on March 1, 2020
Statement of Scope This specification establishes and defines the qualification and performance requirements for the fabrication of rigid printed boards. Purpose The purpose of this specification is...
This document is referenced by:
IPC-7095 - Design and Assembly Process Implementation for Ball Grid Arrays (BGAs)
Published by IPC on June 1, 2018
This standard describes design and assembly implementation for ball grid array (BGA) and fine-pitch BGA (FBGA) technology, focusing on inspection, repair and reliability issues associated with design...
This document is referenced by:
IEC/TS 62647-22 - Process management for avionics – Aerospace and defence electronic systems containing lead-free solder – Part 22: Technical guidelines
Published by IEC on September 1, 2013
This part of IEC 62647 is intended for use as technical guidance by aerospace, defence, and high performance (ADHP) electronic applications and systems suppliers, e.g., original equipment...
This document is referenced by:
IPC-1601 GERMAN - Printed Board Handling and Storage Guidelines
Published by IPC on August 1, 2010
This document provides suggestions for proper handling, packaging materials and methods, environmental conditions, and storage for printed boards. These guidelines are intended to protect printed...
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