UNLIMITED FREE
ACCESS TO THE WORLD'S BEST IDEAS

SUBMIT
Already a GlobalSpec user? Log in.

This is embarrasing...

An error occurred while processing the form. Please try again in a few minutes.

Customize Your GlobalSpec Experience

Select Your Free Newsletters

Industry Newsletters

Select Your Free Product Alerts

Finish!
Privacy Policy

This is embarrasing...

An error occurred while processing the form. Please try again in a few minutes.

BSI - BS PD IEC/TS 62647-3

Process management for avionics - Aerospace and defence electronic systems containing lead-free solder Part 3: Performance testing for systems containing lead-free solder and finishes

active, Most Current
Buy Now
Organization: BSI
Status: active
Page Count: 46
ICS Code (Production. Production management): 03.100.50
ICS Code (Electronic components in general): 31.020
ICS Code (Aerospace electric equipment and systems): 49.060

Document History

BS DD IEC/PAS 62647-3
September 30, 2011
Process management for avionics - Aerospace and defence electronic systems containing lead-free solder Part 3: Performance testing for systems containing lead-free solder and finishes
A description is not available for this item.
BS PD IEC/TS 62647-3
Process management for avionics - Aerospace and defence electronic systems containing lead-free solder Part 3: Performance testing for systems containing lead-free solder and finishes
A description is not available for this item.

References

This document references:
IEC/TS 62647-21 - Process management for avionics – Aerospace and defence electronic systems containing lead-free solder – Part 21: Program management – Systems engineering guidelines for managing the transition to lead-free electronics
Published by IEC on July 1, 2013
This part of IEC 62647 is designed to assist program management and/or systems engineering management in managing the transition to lead-free (Pb-free) electronics to assure product reliability and...
This document references:
IEC 62137-3 - Electronics assembly technology – Part 3: Selection guidance of environmental and endurance test methods for solder joints
Published by IEC on November 1, 2011
This part of IEC 62137 describes the selection methodology of an appropriate test method for a reliability test for solder joints of various shapes and types of surface mount devices (SMD), array...
This document references:
IEC/TS 62647-1 - Process management for avionics – Aerospace and defence electronic systems containing lead-free solder – Part 1: Preparation for a lead-free control plan
Published by IEC on August 1, 2012
This part of the IEC/TS 62647 series defines the objectives of, and requirements for, documenting processes that assure customers and regulatory agencies that ADHP electronic systems containing...
This document references:
IEC/TS 62647-2 - Process management for avionics – Aerospace and defence electronic systems containing lead-free solder – Part 2: Mitigation of deleterious effects of tin
Published by IEC on November 1, 2012
This Technical Specification establishes processes for documenting the mitigating steps taken to reduce the harmful effects of Pb-free tin in electronic systems. This Technical Specification is...
This document references:
IEC/TS 62647-2 - Process management for avionics – Aerospace and defence electronic systems containing lead-free solder – Part 2: Mitigation of deleterious effects of tin
Published by IEC on November 1, 2012
This Technical Specification establishes processes for documenting the mitigating steps taken to reduce the harmful effects of Pb-free tin in electronic systems. This Technical Specification is...
This document references:
IEC/TS 62647-21 - Process management for avionics – Aerospace and defence electronic systems containing lead-free solder – Part 21: Program management – Systems engineering guidelines for managing the transition to lead-free electronics
Published by IEC on July 1, 2013
This part of IEC 62647 is designed to assist program management and/or systems engineering management in managing the transition to lead-free (Pb-free) electronics to assure product reliability and...
View Less
View All
Advertisement