UNLIMITED FREE
ACCESS TO THE WORLD'S BEST IDEAS

SUBMIT
Already a GlobalSpec user? Log in.

This is embarrasing...

An error occurred while processing the form. Please try again in a few minutes.

Customize Your GlobalSpec Experience

Select Your Free Newsletters

Industry Newsletters

Select Your Free Product Alerts

Finish!
Privacy Policy

This is embarrasing...

An error occurred while processing the form. Please try again in a few minutes.

New! AI Engineering Assistant 
- Trained on our vast library of engineering resources.

CENELEC - EN 61190-1-2

Attachment materials for electronic assembly - Part 1-2: Requirements for soldering pastes for high-quality interconnects in electronics assembly

active, Most Current
Organization: CENELEC
Publication Date: 1 May 2014
Status: active
Page Count: 26
ICS Code (Electronic component assemblies): 31.190

Document History

EN 61190-1-2
May 1, 2014
Attachment materials for electronic assembly - Part 1-2: Requirements for soldering pastes for high-quality interconnects in electronics assembly
A description is not available for this item.
EN 61190-1-2
June 1, 2007
Attachment materials for electronic assembly - Part 1-2: Requirements for soldering pastes for high-quality interconnects in electronics assembly
A description is not available for this item.
EN 61190-1-2
June 1, 2002
Attachment Materials for Electronic Assembly Part 1-2: Requirements for Solder Pastes for High-Quality Interconnections in Electronic Assembly
A description is not available for this item.

References

This document is referenced by:
BS EN 62137-4 - Electronics assembly technology Part 4: Endurance test methods for solder joint of area array type package surface mount devices
Published by BSI on February 28, 2015
A description is not available for this item.
This document is referenced by:
EN 61189-5-3 - Test methods for electrical materials, printed boards and other interconnection structures and assemblies - Part 5-3: General test methods for materials and assemblies - Soldering paste for printed board assemblies
Published by CENELEC on March 1, 2015
This part of IEC 61189 is a catalogue of test methods representing methodologies and procedures that can be applied to test printed board assemblies. This part of IEC 61189 focuses on test methods...
This document is referenced by:
BS EN 61189-5-3 - Test methods for electrical materials, printed boards and other interconnection structures and assemblies Part 5-3: General test methods for materials and assemblies — Soldering paste for printed board assemblies
Published by BSI on January 31, 2015
A description is not available for this item.
This document is referenced by:
BS EN 61189-5-2 - Test methods for electrical materials, printed boards and other interconnection structures and assemblies Part 5-2: General test methods for materials and assemblies — Soldering flux for printed board assemblies
Published by BSI on January 31, 2015
A description is not available for this item.
This document is referenced by:
BS EN 61189-5-4 - Test methods for electrical materials, printed boards and other interconnection structures and assemblies Part 5-4: General test methods for materials and assemblies — Solder alloys and fluxed and non-fluxed solid wire for printed board assemblies
Published by BSI on January 31, 2015
A description is not available for this item.
View Less
View All
Advertisement