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IPC - TM-650 2.4.36C

Rework Simulation, Plated-Through Holes for Leaded Components

active, Most Current
Organization: IPC
Publication Date: 1 May 2004
Status: active
Page Count: 2
scope:

This test method is used to simulate the procedures for plated-through hole (PTH) component removal and replacement, in order to determine the effects of rework on the quality and integrity of the PTH barrel and conductor foil on bare rigid or flexible printed boards. The five steps are designed to simulate initial soldering after a preconditioning bake and two subsequent replacements.

Document History

TM-650 2.4.36C
May 1, 2004
Rework Simulation, Plated-Through Holes for Leaded Components
This test method is used to simulate the procedures for plated-through hole (PTH) component removal and replacement, in order to determine the effects of rework on the quality and integrity of the...
TM-650 2.4.36B
August 1, 1997
Rework Simulation, Plated-Through Holes for Leaded Components
A description is not available for this item.
TM-650 2.4.36A
December 1, 1987
Rework Simulation, Plated-Through Holes
A description is not available for this item.

References

This document references:
TM-650 2.1.1.2A - Microsectioning-Semi or Automatic Technique Microsection Equipment (Alternate)
Published by IPC on May 1, 2004
This procedure is an alternate method for preparing multiple metallographic specimen(s) using microsection equipment. The specimen(s) is(are) for evaluation for quality of the laminate system,...
This document references:
J-STD-004 - Requirements for Soldering Fluxes
Published by IPC on November 1, 2011
A description is not available for this item.
This document references:
A-A-59551 - WIRE, ELECTRICAL, COPPER (UNINSULATED)
Published by NPFC on October 6, 2020
This commercial item description (CID) covers the general requirements for solid, bunch-stranded, concentric-lay-stranded, and rope-lay-stranded round, uninsulated, copper conductors for use in...
This document references:
J-STD-006 - Requirements for Electronic Grade Solder Alloys and Fluxed and Non-Fluxed Solid Solders for Electronic Soldering Applications Amendment 1
Published by IPC on October 1, 2017
A description is not available for this item.
This document references:
IPC-TM-650 2.1.1 - Microsectioning, Manual and Semi or Automatic Method
Published by IPC on June 1, 2015
This method is to be used as a guideline for preparing a metallographic specimen of printed boards. The finished microsection is used for evaluating the quality of the laminate system and plated...
This document is referenced by:
IPC-DW-424 - General Specification for Encapsulated Discrete Wire Interconnection Board
Published by IPC on January 1, 1995
This specification establishes the qualification and performance requirements for encapsulated discrete wire interconnection boards having wires which terminate in plated holes.
This document is referenced by:
9701B - Thermal Cycling Test Method for Fatigue Life Characterization of Surface Mount Attachments
Published by IPC on February 1, 2022
This specification establishes a thermal cycling test method to characterize the fatigue lifetimes of surface mount solder attachments of electronic assemblies. The surface mount devices may be...
This document is referenced by:
IPC-6012 SWEDISH - Qualification and Performance Specification for Rigid Printed Boards
Published by IPC on August 1, 2004
Denna specifikation omfattar kvalificering av och utförande hos rigida mönsterkort. Mönsterkortet kan vara enkelsidigt, dubbelsidigt, med eller utan genompläterade hål. Det kan också vara ett...
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