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JSA - JIS C 62137-4

Electronics assembly technology - Part 4: Endurance test methods for solder joint of area array type package surface mount devices

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Organization: JSA
Publication Date: 22 March 2016
Status: active
ICS Code (Electronic component assemblies): 31.190

Document History

JIS C 62137-4
March 22, 2016
Electronics assembly technology - Part 4: Endurance test methods for solder joint of area array type package surface mount devices
A description is not available for this item.

References

This document references:
IEC 60191-6-2 - Mechanical Standardization of Semiconductor Devices - Part 6-2: General Rules for the Preparation of Outline Drawings of Surface Mounted Semiconductor Device Packages - Design Guide for 1,50 mm, 1,27 mm and 1,00 mm Pitch Ball and Column Terminal Packages
Published by IEC on December 1, 2001
A description is not available for this item.
This document references:
IEC 60191-6-5 - Mechanical Standardization of Semiconductor Devices - Part 6-5: General Rules for the Preparation of Outline Drawings of Surface Mounted Semiconductor Device Packages - Design Guide for Fine Pitch-Pitch Ball Grid Array (FBGA)
Published by IEC on August 1, 2001
A description is not available for this item.
This document references:
IEC 61190-1-3 - Attachment materials for electronic assembly – Part 1-3: Requirements for electronic grade solder alloys and fluxed and nonfluxed solid solder for electronic soldering applications
Published by IEC on December 1, 2017
This part of IEC 61190 prescribes the requirements and test methods for electronic grade solder alloys, for fluxed and non-fluxed bar, ribbon, powder solders and solder paste, for electronic...
This document references:
JIS C 60068-2-14 - Environmental testing - Part 2-14: Tests - Test N: Change of temperature
Published by JSA on February 21, 2011
A description is not available for this item.
This document references:
JIS C 62137-3 - Electronics Assembly Technology - Part 3: Selection guidance of environmental and endurance test methods for solder joints
Published by JSA on September 22, 2014
A description is not available for this item.
This document references:
JIS C 6484 - Base materials for printed circuits - Epoxide woven E-glass laminated sheets of defined flammability (vertical burning test)
Published by JSA on March 20, 2005
A description is not available for this item.
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