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NPFC - MIL-DTL-32570

MICROCIRCUIT, LINEAR-DIGITAL, MIXED SIGNAL MICROCONTROLLER, MONOLITHIC SILICON

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Organization: NPFC
Publication Date: 25 April 2017
Status: inactive
Page Count: 49
scope:

This drawing documents the general requirements of a high performance Mixed-Signal Microcontroller microcircuit, with an operating temperature range of -55°C to +95°C.

Document History

DSCC-VID-V62/16627 REV A
June 21, 2022
MICROCIRCUIT, LINEAR-DIGITAL, MIXED SIGNAL MICROCONTROLLER, MONOLITHIC SILICON
Scope. This drawing documents the general requirements of a high performance Mixed-Signal Microcontroller microcircuit, with an operating temperature range of -55ºC to +95ºC.
MIL-DTL-32570
April 25, 2017
MICROCIRCUIT, LINEAR-DIGITAL, MIXED SIGNAL MICROCONTROLLER, MONOLITHIC SILICON
This drawing documents the general requirements of a high performance Mixed-Signal Microcontroller microcircuit, with an operating temperature range of -55°C to +95°C.

References

This document references:
ESDA/JEDEC JS-001 - Electrostatic Discharge Sensitivity Testing Human Body Model (HBM) - Component Level
Published by ESD on December 8, 2016
This standard establishes the procedure for testing, evaluating, and classifying components and microcircuits according to their susceptibility (sensitivity) to damage or degradation by exposure to a...
This document references:
JEDEC JEP 155 - Recommended ESD Target Level for HBM Qualification
Published by JEDEC on July 1, 2018
The intent of this report is to document and provide critical information to assess and make decisions on safe ESD level requirements. The scope of this document is to provide this information to...
This document references:
JEP157A - Recommended ESD-CDM Target Levels
Published by JEDEC on April 1, 2022
The intent of this report is to document and provide critical information to assess and make decisions on safe CDM ESD level requirements. The scope of this document is to provide this information to...
This document references:
JEP95 JEDEC STD NO. 95-1 - JEDEC Standard No. 95-1 Section 4 Design Guidelines
Published by JEDEC on March 1, 1997
INTRODUCTION History JEDEC REGISTERED AND STANDARD OUTLINES FOR SEMICONDUCTOR DEVICES, JEDEC PUBLICATION 95, is the official JEDEC Publication that contains the registered or standard mechanical...
This document references:
JEDEC JESD 51-2 - Integrated Circuits Thermal Test Method Environmental Conditions - Natural Convection (Still Air)
Published by JEDEC on January 1, 2008
This document outlines the environmental conditions necessary to ensure accuracy and repeatability for a standard junction-to-ambient thermal resistance measurement in natural convection.
This document references:
JEDEC JESD 51-7 - High Effective Thermal Conductivity Test Board for Leaded Surface Mount Packages
Published by JEDEC on February 1, 1999
This fixturing further defines the environment for thermal test of packaged microelectronic devices. Its function is to provide an alternate mounting surface for the analysis of heat flow in...
This document references:
JEDEC JESD 51-8 - Integrated Circuit Thermal Test Method Environmental Conditions - Junction-to-Board
Published by JEDEC on October 1, 1999
This specification should be used in conjunction with the overview document JESD51, Methodology for the Thermal Measurement of Component Packages (Single Semiconductor Device) [1] and the electrical...
This document references:
J-STD-020F - Moisture/Reflow Sensitivity Classification for Non-hermetic Surface Mount Devices (SMDs)
Published by JEDEC on December 1, 2022
This classification procedure applies to all non-hermetic SMDs, which, because of absorbed moisture, could be sensitive to damage during solder reflow. The term SMD as used in this document means...
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