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IEC 61191-2

Printed board assemblies – Part 2: Sectional specification – Requirements for surface mount soldered assemblies

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Organization: IEC
Publication Date: 1 May 2017
Status: active
Page Count: 38
ICS Code (Electronic component assemblies): 31.190
ICS Code (Mechanical structures for electronic equipment): 31.240
scope:

This part of IEC 61191 gives the requirements for surface mount solder connections. The requirements pertain to those assemblies that are totally surface mounted or to the surface mounted portions of those assemblies that include other related technologies (e.g. throughhole, chip mounting, terminal mounting, etc.).

Document History

September 1, 2019
PRINTED BOARD ASSEMBLIES – Part 2: Sectional specification – Requirements for surface mount soldered assemblies
A description is not available for this item.
IEC 61191-2
May 1, 2017
Printed board assemblies – Part 2: Sectional specification – Requirements for surface mount soldered assemblies
This part of IEC 61191 gives the requirements for surface mount solder connections. The requirements pertain to those assemblies that are totally surface mounted or to the surface mounted portions of...
June 1, 2013
Printed board assemblies – Part 2: Sectional specification – Requirements for surface mount soldered assemblies
This part of IEC 61191 gives the requirements for surface mount solder connections. The requirements pertain to those assemblies that are totally surface mounted or to the surface mounted portions of...
August 1, 1998
Printed Board Assemblies - Part 2: Sectional Specification - Requirements for Surface Mount Soldered Assemblies
This specification prescribes the requirements for surface mounted solder connections. The requirements pertain to those assemblies that are totally surface mounted or to the surface mounted portions...

References

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