Printed board assemblies – Part 2: Sectional specification – Requirements for surface mount soldered assemblies
|Publication Date:||1 May 2017|
|ICS Code (Electronic component assemblies):||31.190|
|ICS Code (Mechanical structures for electronic equipment):||31.240|
This part of IEC 61191 gives the requirements for surface mount solder connections. The requirements pertain to those assemblies that are totally surface mounted or to the surface mounted portions of those assemblies that include other related technologies (e.g. throughhole, chip mounting, terminal mounting, etc.).