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IEC 61191-2

Printed Board Assemblies - Part 2: Sectional Specification - Requirements for Surface Mount Soldered Assemblies

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Organization: IEC
Publication Date: 1 August 1998
Status: inactive
Page Count: 58
ICS Code (Mechanical structures for electronic equipment): 31.240
scope:

This specification prescribes the requirements for surface mounted solder connections. The requirements pertain to those assemblies that are totally surface mounted or to the surface mounted portions of those assemblies that include other related technologies (e.g. through hole, chip mounting, terminal mounting, etc.).

Document History

September 1, 2019
PRINTED BOARD ASSEMBLIES – Part 2: Sectional specification – Requirements for surface mount soldered assemblies
A description is not available for this item.
May 1, 2017
Printed board assemblies – Part 2: Sectional specification – Requirements for surface mount soldered assemblies
This part of IEC 61191 gives the requirements for surface mount solder connections. The requirements pertain to those assemblies that are totally surface mounted or to the surface mounted portions of...
June 1, 2013
Printed board assemblies – Part 2: Sectional specification – Requirements for surface mount soldered assemblies
This part of IEC 61191 gives the requirements for surface mount solder connections. The requirements pertain to those assemblies that are totally surface mounted or to the surface mounted portions of...
IEC 61191-2
August 1, 1998
Printed Board Assemblies - Part 2: Sectional Specification - Requirements for Surface Mount Soldered Assemblies
This specification prescribes the requirements for surface mounted solder connections. The requirements pertain to those assemblies that are totally surface mounted or to the surface mounted portions...

References

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