Printed Board Assemblies - Part 2: Sectional Specification - Requirements for Surface Mount Soldered Assemblies
|Publication Date:||1 August 1998|
|ICS Code (Mechanical structures for electronic equipment):||31.240|
This specification prescribes the requirements for surface mounted solder connections. The requirements pertain to those assemblies that are totally surface mounted or to the surface mounted portions of those assemblies that include other related technologies (e.g. through hole, chip mounting, terminal mounting, etc.).