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NPFC - MIL-PRF-31032/1

PRINTED WIRING BOARD, RIGID, MULTILAYERED, THERMOSETTING RESIN BASE MATERIAL, WITH OR WITHOUT BLIND AND BURIED PLATED–THROUGH HOLES, FOR SOLDERED PART MOUNTING

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Organization: NPFC
Publication Date: 11 July 2018
Status: active
Page Count: 39
scope:

This specification covers the generic performance requirements for rigid, multilayered (three or more conductor layers) printed wiring boards (hereafter designated printed board) with plated holes, that will use soldering for component/part mounting (see 6.1.1).

Classification. Printed boards are of classified by 1.2.1 and 1.2.2, as specified (see 6.2).

Printed board type. Printed boards covered by this specification sheet are of the following types:

3 - Rigid multilayer board without blind or buried vias.

4 - Rigid multilayer board with blind and/or buried vias.

Composition. The composition designation is defined by the resin system of the dielectric base material (see 6.7) as follows:

M - Mixed based material printed boards. Printed boards of this composition contain layers of two or more different types of thermosetting resin base materials (see 6.7.2).

S - Homogenous thermosetting base material printed boards. Printed board of this composition contain only one type of thermosetting resin base materials (see 6.7.3).

Wrap copper plating grade. The wrap copper plating grade designation is defined by the amount of plated-through hole surface and knee continuous copper plating thickness remaining after surface processing. The grades are as follows:

A - Printed boards of this grade have 80 percent or more of the specified plated-through hole wrap copper plating thickness on the surface and knee after surface processing.

B - Printed boards of this grade have 50 percent or more of the specified plated-through hole wrap copper plating thickness on the surface and knee after surface processing.

C - Printed boards of this grade have 20 percent or more of the specified plated-through hole wrap copper plating thickness on the surface and knee after surface processing.

Unless otherwise specified, the default grade of wrap copper plating is grade A for printed board designs that will not undergo planarization and grade B for designs that require planarization.

intended Use:

This specification sheet was developed for the use of verifying the performance of rigid, woven E-glass reinforced, thermosetting resin base materials, multilayered (three or more conductor... View More

Document History

MIL-PRF-31032/1
July 11, 2018
PRINTED WIRING BOARD, RIGID, MULTILAYERED, THERMOSETTING RESIN BASE MATERIAL, WITH OR WITHOUT BLIND AND BURIED PLATED–THROUGH HOLES, FOR SOLDERED PART MOUNTING
This specification covers the generic performance requirements for rigid, multilayered (three or more conductor layers) printed wiring boards (hereafter designated printed board) with plated holes,...
January 7, 2018
PRINTED WIRING BOARD, RIGID, MULTILAYERED, THERMOSETTING RESIN BASE MATERIAL, WITH OR WITHOUT BLIND AND BURIED PLATED–THROUGH HOLES, FOR SOLDERED PART MOUNTING
This specification sheet was developed for the use of verifying the performance of rigid, woven E-glass reinforced, thermosetting resin base materials, multilayered (three or more conductor layers)...
June 1, 2017
PRINTED WIRING BOARD, RIGID, MULTILAYERED, THERMOSETTING RESIN BASE MATERIAL, WITH OR WITHOUT BLIND AND BURIED PLATED–THROUGH HOLES, FOR SOLDERED PART MOUNTING
This specification sheet was developed for the use of verifying the performance of rigid, woven E-glass reinforced, thermosetting resin base materials, multilayered (three or more conductor layers)...
June 21, 2013
PRINTED WIRING BOARD, RIGID, MULTILAYERED, THERMOSETTING RESIN BASE MATERIAL, WITH OR WITHOUT BLIND AND BURIED PLATED–THROUGH HOLES, FOR SOLDERED PART MOUNTING
This specification sheet was developed for the use of verifying the performance of rigid, woven E-glass reinforced, thermosetting resin base materials, multilayered (three or more conductor layers)...
November 1, 2012
PRINTED WIRING BOARD, RIGID, MULTILAYERED, THERMOSETTING RESIN BASE MATERIAL, WITH OR WITHOUT BLIND AND BURIED PLATED–THROUGH HOLES, FOR SOLDERED PART MOUNTING
This specification sheet was developed for the use of verifying the performance of rigid, woven E-glass reinforced, thermosetting resin base materials, multilayered (three or more conductor layers)...
May 23, 2010
PRINTED WIRING BOARD, RIGID, MULTILAYERED, THERMOSETTING RESIN BASE MATERIAL, WITH OR WITHOUT BLIND AND BURIED PLATED–THROUGH HOLES, FOR SOLDERED PART MOUNTING
This specification sheet was developed for the use of verifying the performance of rigid, woven E-glass reinforced, thermosetting resin base materials, multilayered (three or more conductor layers)...
July 4, 2009
PRINTED WIRING BOARD, RIGID, MULTILAYERED, THERMOSETTING RESIN BASE MATERIAL, WITH OR WITHOUT BLIND AND BURIED PLATED–THROUGH HOLES, FOR SOLDERED PART MOUNTING
This specification sheet was developed for the use of verifying the performance of rigid, woven E-glass reinforced, thermosetting resin base materials, multilayered (three or more conductor layers)...
April 15, 2008
PRINTED WIRING BOARD, RIGID, MULTILAYERED, THERMOSETTING RESIN BASE MATERIAL, WITH OR WITHOUT BLIND AND BURIED PLATED–THROUGH HOLES, FOR SOLDERED PART MOUNTING
This specification sheet was developed for the use of verifying the performance of rigid, woven E-glass reinforced, thermosetting resin base materials, multilayered (three or more conductor layers)...
November 28, 2006
PRINTED WIRING BOARD, RIGID, MULTILAYERED, THERMOSETTING RESIN BASE MATERIAL, WITH OR WITHOUT BLIND AND BURIED PLATED THROUGH HOLES, FOR SOLDERED PART MOUNTING
This specification sheet was developed for the use of verifying the performance of rigid, woven E-glass reinforced, thermosetting resin base materials, multilayered (three or more conductor layers)...
February 24, 2006
PRINTED WIRING BOARD, RIGID, MULTILAYERED, THERMOSETTING RESIN BASE MATERIAL, WITH OR WITHOUT BLIND AND BURIED PLATED THROUGH HOLES, FOR SOLDERED PART MOUNTING
This specification sheet was developed for the use of verifying the performance of rigid, woven E-glass reinforced, thermosetting resin base materials, multilayered (three or more conductor layers)...
October 29, 2004
PRINTED WIRING BOARD, RIGID, MULTILAYERED, THERMOSETTING RESIN BASE MATERIAL, WITH OR WITHOUT BLIND AND BURIED PLATED THROUGH HOLES, FOR SOLDERED PART MOUNTING
This specification sheet was developed for the use of verifying the performance of rigid, woven E-glass reinforced, thermosetting resin base materials, multilayered (3 or more conductor layers)...
June 22, 1999
PRINTED WIRING BOARD, RIGID, MULTILAYERED, THERMOSETTING RESIN BASE MATERIAL, WITH OR WITHOUT BLIND AND BURIED PLATED THROUGH HOLES, FOR SOLDERED PART MOUNTING
This associated specification was developed for the use of verifying the performance of rigid, woven E-glass reinforced, thermosetting resin base materials, multilayered (3 or more conductor layers)...
November 1, 1995
PRINTED WIRING BOARD, RIGID, MULTILAYERED, THERMOSETTING RESIN BASE MATERIAL, WITH OR WITHOUT BLIND AND BURIED PLATED THROUGH HOLES, FOR SOLDERED PART MOUNTING
This associated specification was developed for the use of verifying the performance of rigid, woven E-glass reinforced, thermosetting resin base materials, multilayered (3 or more conductor layers)...

References

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