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NPFC - MIL-PRF-31032/1

PRINTED WIRING BOARD, RIGID, MULTILAYERED, THERMOSETTING RESIN BASE MATERIAL, WITH OR WITHOUT BLIND AND BURIED PLATED−THROUGH HOLES, FOR SOLDERED PART MOUNTING

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Organization: NPFC
Publication Date: 1 March 2020
Status: active
Page Count: 39
scope:

Scope.

This specification covers the generic performance requirements for rigid, multilayered (three or more conductor layers) printed wiring boards (hereafter designated printed board) with plated holes, that will use soldering for component/part mounting (see 6.1.1).

intended Use:

This specification sheet was developed for the use of verifying the performance of rigid, woven E-glass reinforced, thermosetting resin base materials, multilayered (three or more conductor... View More

Document History

MIL-PRF-31032/1
March 1, 2020
PRINTED WIRING BOARD, RIGID, MULTILAYERED, THERMOSETTING RESIN BASE MATERIAL, WITH OR WITHOUT BLIND AND BURIED PLATED−THROUGH HOLES, FOR SOLDERED PART MOUNTING
This specification sheet was developed for the use of verifying the performance of rigid, woven E-glass reinforced, thermosetting resin base materials, multilayered (three or more conductor layers)...
July 11, 2018
PRINTED WIRING BOARD, RIGID, MULTILAYERED, THERMOSETTING RESIN BASE MATERIAL, WITH OR WITHOUT BLIND AND BURIED PLATED–THROUGH HOLES, FOR SOLDERED PART MOUNTING
This specification covers the generic performance requirements for rigid, multilayered (three or more conductor layers) printed wiring boards (hereafter designated printed board) with plated holes,...
January 7, 2018
PRINTED WIRING BOARD, RIGID, MULTILAYERED, THERMOSETTING RESIN BASE MATERIAL, WITH OR WITHOUT BLIND AND BURIED PLATED–THROUGH HOLES, FOR SOLDERED PART MOUNTING
This specification sheet was developed for the use of verifying the performance of rigid, woven E-glass reinforced, thermosetting resin base materials, multilayered (three or more conductor layers)...
June 1, 2017
PRINTED WIRING BOARD, RIGID, MULTILAYERED, THERMOSETTING RESIN BASE MATERIAL, WITH OR WITHOUT BLIND AND BURIED PLATED–THROUGH HOLES, FOR SOLDERED PART MOUNTING
This specification sheet was developed for the use of verifying the performance of rigid, woven E-glass reinforced, thermosetting resin base materials, multilayered (three or more conductor layers)...
June 21, 2013
PRINTED WIRING BOARD, RIGID, MULTILAYERED, THERMOSETTING RESIN BASE MATERIAL, WITH OR WITHOUT BLIND AND BURIED PLATED–THROUGH HOLES, FOR SOLDERED PART MOUNTING
This specification sheet was developed for the use of verifying the performance of rigid, woven E-glass reinforced, thermosetting resin base materials, multilayered (three or more conductor layers)...
November 1, 2012
PRINTED WIRING BOARD, RIGID, MULTILAYERED, THERMOSETTING RESIN BASE MATERIAL, WITH OR WITHOUT BLIND AND BURIED PLATED–THROUGH HOLES, FOR SOLDERED PART MOUNTING
This specification sheet was developed for the use of verifying the performance of rigid, woven E-glass reinforced, thermosetting resin base materials, multilayered (three or more conductor layers)...
May 23, 2010
PRINTED WIRING BOARD, RIGID, MULTILAYERED, THERMOSETTING RESIN BASE MATERIAL, WITH OR WITHOUT BLIND AND BURIED PLATED–THROUGH HOLES, FOR SOLDERED PART MOUNTING
This specification sheet was developed for the use of verifying the performance of rigid, woven E-glass reinforced, thermosetting resin base materials, multilayered (three or more conductor layers)...
July 4, 2009
PRINTED WIRING BOARD, RIGID, MULTILAYERED, THERMOSETTING RESIN BASE MATERIAL, WITH OR WITHOUT BLIND AND BURIED PLATED–THROUGH HOLES, FOR SOLDERED PART MOUNTING
This specification sheet was developed for the use of verifying the performance of rigid, woven E-glass reinforced, thermosetting resin base materials, multilayered (three or more conductor layers)...
April 15, 2008
PRINTED WIRING BOARD, RIGID, MULTILAYERED, THERMOSETTING RESIN BASE MATERIAL, WITH OR WITHOUT BLIND AND BURIED PLATED–THROUGH HOLES, FOR SOLDERED PART MOUNTING
This specification sheet was developed for the use of verifying the performance of rigid, woven E-glass reinforced, thermosetting resin base materials, multilayered (three or more conductor layers)...
November 28, 2006
PRINTED WIRING BOARD, RIGID, MULTILAYERED, THERMOSETTING RESIN BASE MATERIAL, WITH OR WITHOUT BLIND AND BURIED PLATED THROUGH HOLES, FOR SOLDERED PART MOUNTING
This specification sheet was developed for the use of verifying the performance of rigid, woven E-glass reinforced, thermosetting resin base materials, multilayered (three or more conductor layers)...
February 24, 2006
PRINTED WIRING BOARD, RIGID, MULTILAYERED, THERMOSETTING RESIN BASE MATERIAL, WITH OR WITHOUT BLIND AND BURIED PLATED THROUGH HOLES, FOR SOLDERED PART MOUNTING
This specification sheet was developed for the use of verifying the performance of rigid, woven E-glass reinforced, thermosetting resin base materials, multilayered (three or more conductor layers)...
October 29, 2004
PRINTED WIRING BOARD, RIGID, MULTILAYERED, THERMOSETTING RESIN BASE MATERIAL, WITH OR WITHOUT BLIND AND BURIED PLATED THROUGH HOLES, FOR SOLDERED PART MOUNTING
This specification sheet was developed for the use of verifying the performance of rigid, woven E-glass reinforced, thermosetting resin base materials, multilayered (3 or more conductor layers)...
June 22, 1999
PRINTED WIRING BOARD, RIGID, MULTILAYERED, THERMOSETTING RESIN BASE MATERIAL, WITH OR WITHOUT BLIND AND BURIED PLATED THROUGH HOLES, FOR SOLDERED PART MOUNTING
This associated specification was developed for the use of verifying the performance of rigid, woven E-glass reinforced, thermosetting resin base materials, multilayered (3 or more conductor layers)...
November 1, 1995
PRINTED WIRING BOARD, RIGID, MULTILAYERED, THERMOSETTING RESIN BASE MATERIAL, WITH OR WITHOUT BLIND AND BURIED PLATED THROUGH HOLES, FOR SOLDERED PART MOUNTING
This associated specification was developed for the use of verifying the performance of rigid, woven E-glass reinforced, thermosetting resin base materials, multilayered (3 or more conductor layers)...

References

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