This associated specification was developed for the use of verifying the performance of rigid, woven E-glass reinforced, thermosetting resin base materials, multilayered (3 or more conductor layers) printed wiring boards with plated holes (without blind or buried vias), that will use soldering for component mounting. Printed wiring boards of other base material types or construction styles can be tested or verified to the performance requirements contained in this document, however, the performance parameters of other associated specifications may be more appropriate. The supplement for MIL-PRF-31032 contains a list all known and current associated specification at the time of its date and should be consulted for selection of the appropriate associated specification.