This specification sheet was developed for the use of verifying the performance of rigid, woven E-glass reinforced, thermosetting resin base materials, multilayered (three or more conductor layers) printed boards with plated holes (with or without blind or buried vias), that will use soldering for component mounting. Printed boards of other base material types or construction styles can be tested or verified to the performance requirements contained in this document, however, the performance parameters of other MIL−PRF−31032 performance specifications sheets may be more appropriate.