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BSI - BS EN 61188-5-5

Printed boards and printed board assemblies - Design and use - Part 5-5: Attachment (land/joint) considerations - Components with gull-wing leads on four sides

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Organization: BSI
Publication Date: 31 December 2007
Status: active
Page Count: 46
ICS Code (Printed circuits and boards): 31.180

Document History

BS EN 61188-5-5
December 31, 2007
Printed boards and printed board assemblies - Design and use - Part 5-5: Attachment (land/joint) considerations - Components with gull-wing leads on four sides
A description is not available for this item.

References

This document references:
IEC 61191-1 - Printed board assemblies – Part 1: Generic specification – Requirements for soldered electrical and electronic assemblies using surface mount and related assembly technologies
Published by IEC on September 1, 2018
This part of IEC 61191 prescribes requirements for materials, methods and verification criteria for producing quality soldered interconnections and assemblies using surface mount and related assembly...
This document references:
EN 60068-2-54 - Environmental testing Part 2-54: Tests - Test Ta: Solderability testing of electronic components by the wetting balance method
Published by CENELEC on August 1, 2006
A description is not available for this item.
This document references:
EN 60068-2-58 - Environmental testing - Part 2-58: Tests - Test Td: Test methods for solderability, resistance to dissolution of metallization and to soldering heat of surface mounting devices (SMD)
Published by CENELEC on May 1, 2015
This part of IEC 60068 outlines test Td, applicable to surface mounting devices (SMD). This document provides procedures for determining the solderability, resistance to dissolution of metallization...
This document references:
EN IEC 61191-1 - Printed board assemblies - Part 1: Generic specification - Requirements for soldered electrical and electronic assemblies using surface mount and related assembly technologies
Published by CENELEC on November 1, 2018
This part of IEC 61191 prescribes requirements for materials, methods and verification criteria for producing quality soldered interconnections and assemblies using surface mount and related assembly...
This document references:
EN 61188-5-1 - Printed boards and printed board assemblies - Design and use - Part 5-1: Attachment (land/joint) considerations - Generic requirements
Published by CENELEC on October 1, 2002
A description is not available for this item.
This document references:
IEC 60068-2-58 - Environmental testing – Part 2-58: Tests – Test Td: Test methods for solderability, resistance to dissolution of metallization and to soldering heat of surface mounting devices (SMD)
Published by IEC on July 1, 2017
This part of IEC 60068 outlines test Td, applicable to surface mounting devices (SMD) This document provides procedures for determining the solderability, resistance to dissolution of metallization...
This document references:
IEC 60191-2 - Amendment 16 Mechanical Standardization of Semiconductor Devices - Part 2: Dimensions
Published by IEC on July 1, 2007
A description is not available for this item.
This document is referenced by:
BS EN 61188-7 - Printed boards and printed board assemblies - Design and use - Part 7: Electronic component zero orientation for CAD library construction
Published by BSI on September 30, 2017
A description is not available for this item.
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