DLA - SMD-5962-95640
MICROCIRCUIT, LINEAR, DUAL/QUAD, RAIL-TO-RAIL, LOW POWER, OPERATIONAL AMPLIFIER, MONOLITHIC SILICON
| Organization: | DLA |
| Publication Date: | 15 May 1995 |
| Status: | inactive |
| Page Count: | 12 |
scope:
This drawing forms a part of a one part - one part number documentation system (see 6.6 herein). Two product assurance classes consisting of military high reliability (device classes Q and M) and space application (device class V), and a choice of case outlines and lead finishes are available and are reflected in the Part or Identifying Number (PIN). Device class M microcircuits represent non-JAN class B microcircuits in accordance with 1.2.1 of MIL-STD-883, "Provisions for the use of MIL-STD-883 in conjunction with compliant non-JAN devices". When available, a choice of Radiation Hardness Assurance (RHA) levels are reflected in the PIN.
The PIN shall be as shown in the following example:
Device class M RHA marked devices shall meet the MIL-I-38535 appendix A specified RHA levels and shall be marked with the appropriate RHA designator. Device classes Q and V RHA marked devices shall meet the MIL-I-38535 specified RHA levels and shall be marked with the appropriate RHA designator. A dash (-) indicates a non-RHA device.
The device type(s) shall identify the circuit function as follows:
Device type Generic number Circuit function 01 TLC2252M Rail to rail, very low power, dual operational amplifier 02 TLC2254M Rail to rail, very low power, quad operational amplifier
The device class designator shall be a single letter identifying the product assurance level as follows:
Device class Device requirements documentation M Vendor self-certification to the requirements for non-JAN class B microcircuits in accordance with 1.2.1 of MIL-STD-883 Q or V Certification and qualification to MIL-I-38535
The case outline(s) shall be as designated in MIL-STD-1835 and as follows:
Outline letter Descriptive designator Terminals Package style C GDIP1-T14 or CDIP2-T14 14 Dual-in-line D GDFP1-F14 or CDFP2-F14 14 Flat pack H GDFP1-F10 or CDFP2-F10 10 Flat pack P GDIP1-T8 or CDIP2-T8 8 Dual-in-line 2 CQCC1-N20 20 Square leadless chip carrier
The lead finish shall be as specified in MIL-STD-883 (see 3.1 herein) for class M or MIL-I-38535 for classes Q and V. Finish letter "X" shall not be marked on the microcircuit or its packaging. The "X" designation is for use in specifications when lead finishes A, B, and C are considered acceptable and interchangeable without preference.
Supply voltage range (VDD) . . . . . . . . . . . . . −8.0 V dc to +8.0 V dc 2/ Differential input voltage (VID) . . . . . . . . . . −16.0 V dc to +16.0 V dc 3/ Input voltage range (VIN) . . . . . . . . . . . . . . . −VDD − 0.3 V to +VDD Input current, each input (IIN) . . . . . . . . . . . +5.0 mA to −5.0 mA Output current (IOUT) . . . . . . . . . . . . . . . . +50.0 mA to −50.0 mA Total current into +VDD . . . . . . . . . . . . . . . +50.0 mA to −50.0 mA Total current out of −VDD . . . . . .. . . . . . . . . +50.0 mA to −50.0 mA Duration of short-circuit current at or below +25°C . . Unlimited 4/ Maximum power dissipation (PD): 5/ Cases C and 2 . . . . . . . . . . . . . . . . . . . . 1375 mW Case P . . . . . . . . . . . . . . . . . . . . . . . 1050 mW Cases D and H . . . . . . . . . . . . . . . . . . . . 700 mW Operating free-air temperature range (TA) . . . . . . −55°C to +125° Storage temperature range (TSTG) . . . . . . . . . . . −65°C to +150°C Lead temperature (soldering 10 Seconds) . . . . . . . . +260°C Maximum junction temperature (TJ) . . . . . . . . . . . +150°C Thermal resistance, junction to-case (ΘJC) . . . . . . See MIL-STD-1835
Supply voltage (±VDD) . . . . . . . . . . . . . . . . ±2.2 V dc to ±8.0 V dc Input voltage range (VIN) . . . . . . . . . . . . . . −VDD to +VDD − 1.5 V Common-mode input voltage (VIC) . . . . . . . . . . . . −VDD to +VDD − 1.5 V Ambient operating temperature range (TA) . . . . . . . −55°C to +125°C
intended Use:
Microcircuits conforming to this drawing are intended for use for Government microcircuit applications (original equipment), design applications, and logistics purposes.
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