scope:

This drawing forms a part of a one part - one part number documentation system (see 6.6 herein). Three product assurance classes consisting of space application (device class V), military high reliability (device classes M and Q), and non-traditional military (device class N) with a choice of case outlines and lead finishes are available and are reflected in the Part or Identifying Number (PIN). Device class M microcircuits represent non-JAN class B microcircuits in accordance with 1.2.1 of MIL-STD-883, "Provisions for the use of MIL-STD-883 in conjunction with compliant non-JAN devices". For device class N, the user is cautioned to assure that the device is appropriate for the application environment. When available, a choice of Radiation Hardness Assurance (RHA) levels are reflected in the PIN.

The PIN shall be as shown in the following example:

Device class M RHA marked devices shall meet the MIL-I-38535 appendix A specified RHA levels and shall be marked with the appropriate RHA designator. Device classes N, Q, and V RHA marked devices shall meet the MIL-I-38535 specified RHA levels and shall be marked with the appropriate RHA designator. A dash (-) indicates a non-RHA device.

The device type(s) shall identify the circuit function as follows:

Device type Generic number Circuit function 01 TLC2252M Rail to rail, very low power, dual operational amplifier 02 TLC2254M Rail to rail, very low power, quad operational amplifier

The device class designator shall be a single letter identifying the product assurance level as follows:

Device class Device requirements documentation M Vendor self-certification to the requirements for non-JAN class B microcircuits in accordance with 1.2.1 of MIL-STD-883 N Certification and qualification to MIL-I-38535 with a non-traditional performance environment 1/ Q or V Certification and qualification to MIL-I-38535

The case outline(s) shall be as designated in MIL-STD-1835 and as follows:

Outline letter Descriptive designator Terminals Package style C GDIP1-T14 or CDIP2-T14 14 Dual-in-line D GDFP1-F14 or CDFP2-F14 14 Flat pack H GDFP1-F10 or CDFP2-F10 10 Flat pack P GDIP1-T8 or CDIP2-T8 8 Dual-in-line Z CQCC1-N20 20 Square leadless chip carrier X See figure 1 8 Plastic small outline y See figure 1 14 Plastic small outline

The lead finish shall be as specified in MIL-STD-883 (see 3.1 herein) for class M or MIL-I-38535 for classes N, Q, and V. Finish letter "X" shall not be marked on the microcircuit or its packaging. The "X" designation is for use in specifications when lead finishes A, B, and C are considered acceptable and interchangeable without preference.

Lead finish D shall be designated by a single letter as follows:

Finish letter Process D Palladium

For device class N, plastic encapsulated microcircuits (PEMs) the following manufacturer PIN (see 3.5.1 herein) shall be marked:

Absolute maximum ratings.2/ Supply voltage range (V_DD) . . . . . . . . . . . . . . −8.0 V dc to +8.0 V dc 2/ Differential input voltage (V_ID) . . . . . . . . . . . −16.0 V dc to +16.0 V dc 3/ Input voltage range (V_IN) . . . . . . . . . . . . . . . −V_DD - 0.3 V to +V_DD Input current, each input (I_IN) . . . . . . . . . . . . +5.0 mA to −5.0 mA Output current (I_OUT) . . . . . . . . . . . . . . . . . +50.0 mA to −50.0 mA Total current into +V_DD . . . . . . . . . . . . . . . . +50.0 mA to −50.0 mA Total current out of V_DD . . . . . . . . . . . . . . . +50.0 mA to −50.0 NA Duration of short-circuit current at or below +25°C . . Unlimited 4/ Maximum power dissipation (P_D):5/ Cases C and 2 . . . . . . . . . . . . . . . . . . . . 1375 mW Case P . . . . . . . . . . . . . . . . . . . . . . . 1050 mW Cases D and N . . . . . . . . . . . . . . . . . . . . 700 mW Case X . . . . . . . . . . . . . . . . . . . . . . . 725 mW Case Y . . . . . . . . . . . . . . . . . . . . . . . 950 mW

Absolute maximum ratings - Continued. 2/ Operating free-air temperature range (T_A) . . . . . . −55°C to +125° Storage temperature range (T_STG) . . . . . . . . . . −65°C to +150°C Lead temperature (soldering 10 seconds) . . . . . . . +260°C Maximum junction temperature (T_J) . . . . . . . . . . +150°C Thermal resistance, junction-to-case (Θ_JC.) . . . . . See MIL-STD-1835

Recommended operating Conditions. Supply voltage (±V_DD) . . . . . . . . . . . . . . . . ±2.2 V dc to ±8.0 V dc Input voltage range (V_IN) . . . . . . . . . . . . . . . −V_DD to +V_DD − 1.5 V Common-mode input voltage (V_IC) . . . . . . . . . . . . −V_DD to +V_DD − 1.5 V Ambient operating temperature range (T_A) . . . . . . . −55°C to +25°C